IC Testing and Development in Semiconductor AreaPrepare by Lee Zhang, 2004 业实集成 版权所有 翻印必究 www.yesic.com.cn Outline 1. Electronic Industry Development 2. Semiconductor Industry Development 业实集成 版权所有 翻印必究 www.yesic.com.cn 4Electronic Industry Development Electronic Industry in Worldwide and in China Wide Electronic product revenue in worldwide is $1.5 trillion (US dollar) at year of 2003. Electronic product revenue in China wide is $160 billion (US dollar) at year of 2003, which is about 11% of world revenue. Electronic product revenue in China wide is $180 billion (US dollar) at year of 2004, and it will be reached $270 billion by 2007. 业实集成 版权所有 翻印必究 www.yesic.com.cn 4Electronic Industry Development Electronic Industry in Worldwide and in China Wide Electronic industry revenue in China wide is $227 billion (US dollar) at year of 2003. 2003 China electronics export is $124 billion, 1/3 of China total export. 业实集成 版权所有 翻印必究 www.yesic.com.cn 4Electronic Industry Development Electronic Products Produced on 2003 PC revenue was 48 million units. TV revenue was 58 million units. Mobile phone was 211 million units. Communication bandwidth exchange equipments were increased by over 40%. Auto mobile industries were increased by over 40% and will be reached $5.5 billion revenue on 2007. 业实集成 版权所有 翻印必究 www.yesic.com.cn 4Electronic Industry Development Electronic Products vs.yesic. 1) CPU design and development 2) DSP design and development 3) LCD design and development 4) Mobile phone related chip design and development 业实集成 版权所有 翻印必究 www.2 billion at year of 2003. which is about 16% of worldwide revenue.com. Semiconductor Semiconductor revenue in worldwide is $163 billion (US dollar) at year of 2003. Semiconductor revenue in China wide is $25.cn . com.4Semiconductor Development How to look into semiconductor industry development? People give a prediction for 10 years or 50 years or forever in changing or keeping semiconductor materials or factor. Companies change the strategy to challenge the semiconductor industry. More business specialists believe the market is the key to look into. 业实集成 版权所有 翻印必究 www.cn .yesic. Someone only look for the business cycles to believe the development no ending. yesic.4Semiconductor Development How to look into China’s semiconductor industry development? China’s semiconductor industry has a very young age. China is not concerning the problem with the world but we need more intellectual properties.cn . and Europe. Japan. China’s semiconductor is learning the business strategies from USA. 业实集成 版权所有 翻印必究 www. China would look into high-end products in semiconductor development.com. com. 业实集成 版权所有 翻印必究 www.yesic. smart card chip). Developing new mini product design and simple circuit design (like digital circuit design on mobile phone chip.4Semiconductor Development The Strong Point and The Weak Point From China Semiconductor Development Developing traditional and continuous able products (like analog circuit design).cn . Semiconductor manufacturing cost reduction and competition (low-end process like 6” wafer manufacture). Lack of intellectual property of design and technology. facility cost.cn . Lack of good base of technology research and professional experience on high-end design.com. 业实集成 版权所有 翻印必究 www. Lack of long-term strategies to invest a research and development center.yesic.4Semiconductor Development The Strong Point and The Weak Point From China Semiconductor Development Build low cost bases for manufacturing of assembly and testing (like real-state cost. material cost and engineer cost). com.cn . Basic Manufacture Test Flow 6. Basic Production Test Flow 7. Overview IC Testing Establishment 2.yesic. The Types of Tests in IC Manufacture 3. The Types of IC Product Tests 4. Test Classification 5. Impact Test Cost in IC Manufacture 业实集成 版权所有 翻印必究 www.Outline 1. Other Important Facilities 业实集成 版权所有 翻印必究 www. Quality and Reliability 11.Outline 8. Tester Divided by Test Functions 13.cn .yesic. Impact Test Cycle in IC Manufacture 9.com. Tester Divided by Test Capabilities 12. Test vs. Objectives of Product and Production Testing 10. cn .com.yesic.4Overview IC Test Establishment How is IC test established? From design point of view From manufacture point of view From system design point of view From failure analysis point of view From customer requirement point of view How important is the testing in IC industry? Measuring new products realistic Monitoring manufacture process Evidence for consumer acceptance 业实集成 版权所有 翻印必究 www. com.4Overview IC Test Establishment What is the future development for IC test? Design for self-test Separate IP core test Multiple test methods on single tester Simple product test with complicated tester Reduce software development time 业实集成 版权所有 翻印必究 www.cn .yesic. 4Types of Testing in IC Mfg. Detail Included Each Test Type Design types: design simulation test. How many are the major types of testing? Design type of test.yesic.cn .com. 业实集成 版权所有 翻印必究 www. design characterization test and design qualification test. Manufacture or product type of test. Physical failure analysis type of test. design debug test. Production type of test. Reliability type of test. engineering test and yield enhancement test. Reliability types: characterization test and qualification test. assembly package test. Detail Included Each Test Type Mfg and product types: process step test.4Types of Testing in IC Mfg. Physical FA types: 业实集成 版权所有 翻印必究 www. E (electron) test.cn . final test and QA test.yesic. Production types: wafer probing test.com. 业实集成 版权所有 翻印必究 www. Soc devices. Logic types – programmable logic devices. RF types – optical and communication devices.yesic. LCD types – display driver devices. Mixed-signal types – analog and digital devices.4Types of Product Testing Six Types of Product Testing in IC Field Memory types – ROM and RAM devices. microcontroller.cn .com. System types – embedded. com. USB.cn . FPGA.4Testing Classification Memory Testing (SRAM. DAC.yesic. Flash Memory. CPU) Mixed Signal Testing (ADC. Vregulator. DRAM. DAC) SoC Testing (System on Chip Device) LCD Testing (Liquid Crystal Driver) IP Testing (PLL. PLD. Bandgap. EEPROM. Embedded Memory) Logic Testing (ASIC. High-Speed I/O and so on) 业实集成 版权所有 翻印必究 www. ADC. 4Impact of Testing Cost Requiring huge amounts of investments Largely varying with volumes Product and process maturity Product and process complexity Product lead time (testing on wafer. packaging cycle time and package testing) 业实集成 版权所有 翻印必究 www.com.cn .yesic. cn .4Impact of Testing Cycle Design for Testability (DFT in design side) Characterization (design development) Reliability Assessment (process manufacturing) Pre-production Testing (product engineering) Production Testing (production manufacturing) Yield Enhancement (product engineering) 业实集成 版权所有 翻印必究 www.yesic.com. 4Impact of Testing Cycle Performance Improvement (process engineering) Test cost Reduction (manufacturing side) Product Cost Reduction (production side) 业实集成 版权所有 翻印必究 www.com.cn .yesic. 4Objective of Production Testing Screening sequence Performance of specification Collecting data for better control Manufacturing process fine-tuning Progress in yield enhancement process Same product by different classes of performance (speed.cn .com.yesic. temperature range. vcc range. W/R & R/W performance) 业实集成 版权所有 翻印必究 www. Quality and Reliability Design of the cell. resources. process and product Debug and characterization of process and product Manufacturing machine: equipment.yesic.com.cn .4Testing vs. materials and so on The overall process control The reliability assessment of process and product The overall know-how of the manufacture 业实集成 版权所有 翻印必究 www. com. Power Supply.cn . Power Meter.4Tester Divided by Test Capabilities Bench-top Tester (PC based. Oscilloscopes and so on) 业实集成 版权所有 翻印必究 www.yesic. HP93000 Tester.cn .4Tester Divided by Test Capabilities Automatic Tester (Advantest.com. Mosaid Tester and Teradyne Tester and so on) 业实集成 版权所有 翻印必究 www.yesic. Yokogawa Tester and so on) SoC/LCD Device (Teradyne Tester and Yokogawa Tester and so on) IP Testchip (Bench-Top and ATE) 业实集成 版权所有 翻印必究 www.yesic. Mosaid Tester) Mixed-Signal Device (Teradyne Tester and HP93000.com. HP93000 Tester.cn .4Tester Divided by Test Functions Logic Device (Credence Tester. Teradyne Tester and so on ) Memory Device (Advantest. yesic.cn .com.4Other Important Facilities Probe Station Handler Laser Repair/Laser Mark Probe Card DUT Board 4x1 业实集成 版权所有 翻印必究 www. Test Methodology and Test Flow 业实集成 版权所有 翻印必究 www. Basic Test Items 4.yesic.Outline 1. Basic Test Flow and DUT Flow 3. Purpose of Testing 2.com.cn . .Monitor the quality of incoming products 业实集成 版权所有 翻印必究 www.Guarantee the products meet design targets. .Verification of the product’s functions .1) Purposes of Testing For Design Houses or for Foundry . and requirement.Pre-screen for reliability test.cn . For Customers .yesic.Quality assurance to the production process. .Meet customer spec.com. com.2) Basic Testing Flow IC Fabrication Yield: Fraction of good parts Testing Quality: Shipped Parts Defective parts per million (DPM) Rejects 业实集成 版权所有 翻印必究 www.yesic.cn . com.2) Basic DUT Flow Test Stimulus DUT DUT Response Good Or Bad ? Pass Fail 业实集成 版权所有 翻印必究 www.yesic.cn . com.cn .yesic.3) Basic Test Items 4DC Parameter Test (Static Test) 4Functional Test 4AC Parameter Test (Dynamic Test) 4Reliability Related Test 业实集成 版权所有 翻印必究 www. yesic. Iol / IoH) Dynamic Current Test (Power Consumption) Quiescent Current Test (Standby and Power Down) 业实集成 版权所有 翻印必究 www.cn . (Iil / lih) Output Driving Test (Vol / Voh.com.4DC Parameter Test When a voltage or current is measured during the test and the pass/fail results are based upon the measured value Continuity Test (Open & Short) Leakage Test. yesic.4DC Parameter Test (Datasheet) 业实集成 版权所有 翻印必究 www.com.cn . com. Input data is supplied to DUT and output data is read from the DUT to determine the pass/fail results of the test. Configuration Test (registers. state-machine and output configuring and logic functionality) Pattern Test (program/verify or write/read and different patterns test and memory functionality) Sense Amplifier Functionality Test Build-in-Self-Test (BIST and DFT) 业实集成 版权所有 翻印必究 www.4Function Test When the device is actively performing logical functions.yesic.cn . cn .yesic.4AC Parameter Test AC testing is performed by setting up the appropriate timing values (edge placements) and signal formats as defined in the device AC specification and then executing a functional test sequence. Setup Time Hold Time Output Propagation Delay Pulse Width Rising Time Falling Time 业实集成 版权所有 翻印必究 www.com. com.cn .4AC Parameter Test (Datasheet) 业实集成 版权所有 翻印必究 www.yesic. com.4AC Parameter Test (Timing Diagram) 业实集成 版权所有 翻印必究 www.cn .yesic. Setup Time Data Input Setup Time Relative to /WE Low to High Transition WE Data In Setup Time 业实集成 版权所有 翻印必究 www.com.yesic..cn . Hold Time Data Input Hold Time Relative to /WE Low to High Transition WE Data In Hold Time 业实集成 版权所有 翻印必究 www.yesic.cn ..com. com.cn .yesic..Propagation Delay Output Propagation Delay Relative to Address Valid Time Address Valid Address Data In Valid Data Propagation Delay 业实集成 版权所有 翻印必究 www. com..yesic.Pulse Width/Rise Time/Fall Time WE Pulse Width Data In Rise Time Fall Time 业实集成 版权所有 翻印必究 www.cn . cn .AC Signal Waveform 业实集成 版权所有 翻印必究 www.com.yesic.. cn .yesic.com.4Reliability Related Test Program Cycling Test Program High Temperature Test Bake Between Test from Step to Step Burn-in Between Test from Step to Step 业实集成 版权所有 翻印必究 www. 4) Test Methodology & Test Flow 4Test Aspects 4Test Methods 4Block Test Flow 4Test Program Flow 4Software Accomplishment 业实集成 版权所有 翻印必究 www.com.cn .yesic. cn .yesic.4Test Aspects DC Test & Parametric AC Test & Parametric Functional Programming Test Retention / Endurance Reliability Test Write / Read / Verify Functional Test Mixed Signal Converting Test High Speed I/O Driver Test Check Build-In-Self-Test Frequency / Timing Input and Output Test 业实集成 版权所有 翻印必究 www.com. or Logic CPU) Understand Test Specification and Criteria (Datasheet.yesic. Design Architecture) Create a Block Test Flow (Test steps of overall) Create a Detail Spec. SoC or Mixed-Signal.4Test Methods Understand Device Technology (Memory. Test Flow (Program test flow) Program Development -> Program Debugging > Program Verification Program Delivery to Engineering Test or Production Test 业实集成 版权所有 翻印必究 www.com.cn . com.yesic.cn .4Manufactury Test Flow Wafer Acceptance Testing Final (Package) Testing Design Debug Testing Quality Control Testing Reliability Testing Characterization (Engineering) Testing Wafer Sort Testing Incoming (Inspection) Testing 业实集成 版权所有 翻印必究 www. com.cn .4Production Test Flow Wafer Acceptance Testing Wafer Sort Testing Repair If Failed Testing Packaging If Passed Testing Final (Package) Testing Marking And Testing Quality Control Testing FG or Shipping 业实集成 版权所有 翻印必究 www.yesic. Wafer Sort 2 Final Test 1 Final Test 2 QA/QC Test 业实集成 版权所有 翻印必究 www.yesic.com.4Block Test Flow Wafer Sort 1 Assembly (Package) Burn-in For Monitor Bake at High Temp.cn . cn .4Test Program Flow Continuity Test Program Ptn And Verify AC Parameter Test ICC and Standby Test AD/DA Convert Test Program Pattern & ID Configuration Or Logic Test Bist and Scan Test Verify Pattern & ID 业实集成 版权所有 翻印必究 www.com.yesic. cn .com.yesic.4Software Accomplishment Wafersort 1(Chip Probing -1) Test Program Wafersort 2 (Chip Probing -2) Test Program Final Test Program 1 Final Test Program 2 QA/QC Test Program (Qualification check for delivery test) 业实集成 版权所有 翻印必究 www. ) to the total manufacturing cost of the product. a) Higher integration of circuit (mixed digital and analog signal. Embedded memory) b) High speed signaling (over 500MHz) 业实集成 版权所有 翻印必究 www.yesic. Testing is expensive and will be even more expensive if changes are made.cn .com.4Summary Testing of complex ICs is responsible for the second highest contribution (after wafer fab.