ABSTRACTThis project deals with the design and simulation of solar water pumping system using ¼ watt single phase induction motor. The main scope is to provide an economic way of water pumping in sub-urban areas. The design and evaluation of an induction motor-driven water pumping system which is powered by solar panels is configured in this project. Simulation can be used to study the behavior of individual components of the system, study the interaction of various components, or fine-tune the set points of control device. The outputs of the simulation are available either in numeric or graphical form. The reason why an induction motor has been chosen is that these motors are cheaper and more robust than the more conventional DC motors. It is expected that, by using an induction motor, the system performance will improve significantly for the same investment. The efficiency of the AC drive for a 350 WP system was found to be 67%, which is similar to that of DC systems. The source of energy is from a photovoltaic (PV) module which is a current source. The Modeling & Simulation of system has been carried out using MATLAB software. The practical implementation is also done. v TABLE OF CONTENTS CHAPTER NO. TITLE PAGE NO. ABSTRACT iv LIST OF FIGURES ix LIST OF SYMBOLS xi 1. OVERVIEW OF THE PROJECT 1.1 INTRODUCTION 1 1.2 LITERATURE REVIEW 3 1.3 OBJECTIVE OF THE PROJECT 4 2. PHOTOVOLTAIC MODELLING 2.1 ENERGY AND ITS REQUIREMENT 5 2.2 BRIEF HISTORY OF SOLAR CELL 6 2.3 PHOTOVOLTAIC CELLS AND POWER 7 GENERATION 2.3.1 Photovoltaic Cell 7 2.3.2 Photovoltaic generator 7 2.4 THE PHOTOVOLTAIC EFFECT 9 2.5 SOME IMPORTANT DEINITIONS 9 2.6 EQUIVALENT CIRCUIT OF A SOLAR CELL 11 2.6.1 Ideal Solar Cell 11 2.6.2 Parasitic Resistances 12 2.7 MATLAB MODEL OF A PV SYSTEM 12 2.8 SIMULATION OF A PV MODULE 14 3 DESIGN AND SIMULATION OF BUCKBOOST CONVERTER 3.1 NEED FOR CONVERTERS 17 vi 3.2 TYPES OF CONVERTERS 18 3.3 CHOICE OF BUCK BOOST CONVERTER 18 3.3.1. Operation Of Buck Boost Converter 19 3.3.2 The Inverting Topology 19 3.3.3 A Buck Converter Followed By A Boost 20 Converter 3.4 SIMULATION OF BUCK BOOST CONVERTER 21 3.5 SIMULATION RESULTS OF BUCK BOOST 22 CONVERTER 4. DESIGN AND SIMULATION OF SINGLE PHASE INVERTER 4.1 NEED FOR AN INVERTER 23 4.2 GENERAL CLASSIFICATION OF SINGLE PHASE 24 INVERTERS 4.3 FULL BRIDGE INVERTER 24 4.3.1 Principle Of Operation 24 4.4 APPLICATIONS 28 4.5 MATLAB SIMULINK 28 4.6 SIMULATION RESULTS 29 5 DESIGN AND SIMULATION OF SINGLE PHASE INDUCTION MOTOR 5.1 SINGLE PHASE INDUCTION MOTOR AN 30 INTRODUCTION 5.2 PRINCIPLE OF OPERATION 31 5.2.1 Construction 31 5.2.2 Working Principle 32 5.2.3 Double Field Revolving Theory 33 vii 5.3 STARTING OF SINGLE PHASE INDUCTION 35 MOTORS 5.3.1 Capacitor Start Induction Motor 35 5.4 SIMULATION OF CAPACITOR RUN INDUCTION 36 MOTOR 5.4.1 No Load Test 37 5.4.2 Blocked Rotor Test 37 5.5 SIMULINK MODEL 37 5.6 SIMULATION RESULTS 39 6 HARDWARE IMPLEMENTATION 6.1 GENERAL BLOCK DIAGRAM 41 6.2 OPTIONS CONSIDERED 42 6.2.1 Solar Array 42 6.2.2 Converter 42 6.2.3 DC Battery Source 44 6.2.4 Inverter 44 6.2.5 Single Phase Induction Motor 44 6.2.6 Astable Multivibrator 45 6.2.7 Hardware Results 47 7 CONCLUSION AND SCOPE FOR FUTURE WORK 7.1 CONCLUSION 53 7.2 FUTURE SCOPE 53 viii APPENDIX I 54 APPENDIX II 57 REFERENCES 58 ix LIST OF FIGURES FIGURE NO. TITLE PAGE NO. 2.1 Photovoltaic array integrated with components 8 For charge regulation and storage 2.2 A solar cell in a simple circuit 10 2.3 Equivalent circuit of an ideal solar cell 12 2.4 Equivalent circuit including series and shunt 13 resistance 2.5 Matlab Simulink diagram of a PV module 14 2.6 V-I and P-V characteristics of PV module at STC 15 2.7 Simulated V-I and V-P Characteristics of SPV 15 module for Various Insolation at Constant Temperature T=25 0 C 2.8 Simulated V-I and V-P Characteristics of SPV 16 module for Various Temperature at Constant Insolation G = 1000W/m 2 3.1 Circuit of buck-boost converter 20 3.2 Simulation of buck-boost converter 22 3.3 Output characteristics of buck-boost converter 22 4.1 Mode1 operation of single phase inverter 25 4.2 Mode2 operation of single phase inverter 26 4.3 Mode3 operation of single phase inverter 27 4.4 Mode4 operation of single phase inverter 28 4.5 Simulink model of single phase inverter 29 4.6 Output voltage of single phase inverter 29 5.1 Elementary single phase induction motor 31 x 5.2 Flux Rotation 34 5.3 Torque-speed characteristic of a 1-phase induction 34 motor 5.4 (a) connection; (b) phasor diagram at start 36 5.5 Simulink model of induction motor 38 5.6 T-n characteristics of single phase induction motor 39 5.7 tion motor 39 5.8 Overall matlab simulink circuit 40 6.1 Block diagram of Photovoltaic water pumping system 41 6.2 Arrangement of solar PV array 42 6.3 Hardware model of Buck Boost converter 43 6.4 Inverter and battery setup 44 6.5(a) Water pumping arrangement 45 6.5(b) Practical induction motor 45 6.6 Pcb circuit of an astable multivibrator 46 6.7 Entire setup of the PV water pumping system 47 6.8 Setup of the Induction Motor and the pump. 48 6.9 Astable multivibrator pulses 48 6.10 PIC control pulses 49 6.11 Inverter output voltage and Inverter output current 49 6.12 Battery charging current and Battery discharging current 50 6.13 Battery output voltage 50 6.14 Induction motor output current and output voltage 51 6.15 Induction motor output voltage and current 51 xi LIST OF SYMBOLS K - Boltzmanns constant (=1.381x10 -23 J/K) V c - Capacitor voltage of the converter Q - Charge of electron (=1.602x10 -19 C) I D - Current through the diode in PV model I sh - Current through the shunt resistance A - Diode Ideality factor (1< a< 2 for a single cell) I r - Diode reverse saturation current in PV model D - Duty ratio of converter I L - Inductor current of the converter G - Insolation level X m - Magnetizing component of an induction motor I mp - Maximum output current of PV panel P mp - Maximum Power of PV panel G n - Nominal Insolation level (1000 W/m 2 ) I pvn - Nominal photocurrent of PV panel T n - Nominal Temperature (273K) of PV panel V ocn - Nominal value of open circuit voltage of PV panel I scn - Nominal value of short circuit current of PV panel V oc - Open circuit voltage of PV panel I ph - Photon generated current of the PV module xii xiii I pv - PV panel current V pv - PV panel Voltage R r ,L r - Rotor resistance and Inductance of Induction motor R se - Series Resistance in PV model I sc - Short Circuit current of PV panel K i - Short-circuit current temperature Coefficient in PV model R sh - Shunt Resistance in PV model R a ,L a - Stator resistance and Inductance of Induction motor F - Switching frequency of the converter T - Temperature V ta - Thermal Voltage (=aKT/q) J se - Short circuit current density J dark - Dark current density J o - Constant - Efficiency V o - Output voltage of converter V s - Input voltage to the converter L 1 ,C 1 - Inductance and Capacitance of the converter V oi - Output voltage from the inverter V si - Input voltage to the inverter Ns - Synchronous Speed of the induction motor 1 CHAPTER 1 OVERVIEW OF THE PROJECT 1.1 INTRODUCTION Water pumping has a long history; so many methods have been developed to pump water with a minimum of effort. These have utilized a variety of power sources, namely human energy, animal power, hydro power, wind, solar and fossil fuels for small generators. Nowadays the electric energy is mostly obtained from hydroelectric fossil or nuclear plants. In the past decades alternative and renewable energy sources have deserved a growing interest due to environmental issues. Considering that traditional energy sources are finite (e.g. petroleum), the costs per generated kWh are expected to be continuously hiking. On the other hand, the dissemination of energy generation plants, together with R&D in system components and processes, pulled the generation costs of alternative energy sources to levels in many cases competitive with traditional sources. Recent awareness of global warming and increasing prices of fossil fuels has drawn more attention towards the usage of renewable energy sources today. Among the various renewable energy systems, solar energy systems have the merits such as clean without any environmental pollution problems and infinite in mass, and are becoming one of our future energies .Using an abundant primary source, the solar photovoltaic (SPV) cells (associated in photovoltaic modules) convert the radiant energy from the sun directly into electricity. 2 Albeit the various alternatives, solar energy comes at the top of the list due to its abundance, and more even distribution in nature than any other renewable energy such as wind, geothermal, hydro, wave and tidal energies . Moving on to the solar water pumping system, there is tremendous scope in this area particularly in India. Because, with about 300 clear, sunny days in a year, India's theoretical solar power reception, on only its land area, is about 5 Petawatt- hours per year (PWh / year) (i.e. 5 trillion kWh / year or about 600 TW). The daily average solar energy incident over India varies from 4 to 7 kWh / m 2 with about 15002000 sunshine hours per year (depending upon location), which is far more than current total energy consumption. For example, assuming the efficiency of PV modules was as low as 10%; this would still be a thousand times greater than the domestic electricity demand. This would be sufficient as well to meet the electricity demands in urban areas and electricity requirements for irrigation would be easily settled. In this project, DC voltage obtained from solar PV array is boosted up using a buck-boost converter. The boosted voltage is fed into inverter to make it alternating in nature and this voltage is fed to induction motor. A centrifugal pump is driven that is mounted on the same shaft of induction motor. The individual components mentioned above are discussed in detail in forthcoming chapters. 3 1.2 LITERATURE REVIEW In 1993, the paper Optimized solar water pumping system based on induction motor driven centrifugal pump, by C.V. Nayar , E. Vasu , S.J. Phillips [11] suggests development of induction motor driven submersible centrifugal pump formed by two power electronic interfaces , each forming a complete photovoltaic system. In 1993, the paper Optimum matching of direct coupled electro mechanical loads to a photovoltaic generator by K. Khousem and L.Khousem [7] points out that the performance of photo voltaic pumping system based on an induction motor are degraded once the insulation varies far from the value called nominal, where the system was sized. In 1996, the paper Development for a model for photovoltaic arrays suitable for use in simulation studies of solar energy conversion systems by J.A. Gow and C.D. Manning [4] focuses on developing a clean but effective system to characterize existing cells and generate device-dependent data that links environmental irradiance , temperature and electrical characteristics. In 1995, the paper Simulation and Performance of photovoltaic pumping system by W. Lawrance, B. Richert and T. Langridge [8] describes an efficient system for pumping water using a Brushless D.C motor driven by PV array. 4 In 2010, the paper A comparative study on performance improvement of a Photovoltaic pumping system by A. Betka and A. Moussi [1] suggests the optimal operation of photo voltaic pumping system based on induction motor driving a centrifugal pump .The optimization problem consists in maximizing the daily pumped water quantity via the optimization of motor efficiency for any operating point. 1.3 OBJECTIVE OF THE PROJECT To design a photovoltaic system that yields maximum efficiency so that this system can be used in sub urban areas. This project also aims at effective storage. The effective storage parameters are the volume of tank, height at which the tank is situated from the ground. So this project mainly focuses on effective storage of hydraulic energy. 5 CHAPTER 2 PHOTOVOLTAIC MODELLING 2.1 ENERGY AND ITS REQUIREMENT Energy is the basic unit of life. The existence of mankind is impossible without energy. This project is concerned about electrical energy. At the present scenario, the source of electrical energy is only from non-renewable resources. These resources have been continuously depleted to benefit mankind. However these non-renewable resources will not be available after a few decades. The only possible solution is the usage for renewable resources which are abundant in nature. Amongst the renewable resources the photovoltaic resource has a key role. This project focuses on utilizing the solar energy in an efficient way for water pumping in remote areas where electricity is always a major concern. Also solar PV systems do not require fuel and waste management and have no pollution problems. A solar cell is used to trap energy from sunlight. In order to process the power generated by the solar cell, converter is used at the output side of the solar cell. A buck- boost converter is chosen for water pumping application. The output voltage of the converter may contain ripples. To reduce these ripples LC filter is added after the converter. The only disadvantage in using solar PV system is the rise of initial cost. However researches are being carried on to overcome this. 6 2.2 BRIEF HISTORY OF SOLAR CELL The photo voltaic effect was first reported by Edmund Bequerel in 1839 when he observed that the action of light on a silver coated platinum electrode immersed in electrolyte produced an electric current. In 1876 William Adams and Richard Day found that photo current could be produced in a sample of selenium when heated by two heated platinum contacts. The photovoltaic action of the selenium differed from its photo conductive action in that a current was produced spontaneously by the action of light. No external power supply was needed. In 1894, Charles Fritts prepared what was probability the first large area solar cell by pressing a layer of selenium between gold and another metal. However, it was not the photo voltaic properties of materials like selenium which excited researchers, but the photoconductivity. The fact that the current produced was proportional to the intensity of the incident light, and related to the wavelength in a definite way meant that photoconductive materials were ideal for photographic light meters. It was not until the 1950s, with the development of good quality silicon wafers for applications in the new solid state electronics, that potentially useful quantities of power were produced by photovoltaic devices in crystalline silicon. The first silicon solar cell was reported by Chapin, Fuller and Pearson in 1954 and converted sunlight with an efficiency of 6%, six times higher than previous attempt. Nevertheless, the early silicon solar cell did introduce the possibility of power generation in remote locations where fuel could not be easily delivered. The 7 obvious application was to satellites where the requirement of reliability and low weight made the cost of cells unimportant and during the 1950s and 60s, silicon solar cells were widely developed for applications in space. 2.3 PHOTOVOLTAIC CELLS AND POWER GENERATION 2.3.1 Photovoltaic Cell The solar cell is the basic building block of solar photovoltaic. Solar cells consist of a p-n junction fabricated in a thin wafer or layer of semi-conductor the cell can be considered as a two terminal device which conducts like a diode in the dark and generates a photovoltaic voltage when charged by the sun. Usually it is a thin slice of semiconductor material of around 100 cm 2 area. The surface is treated to reflect as little visible light as possible and appears dark blue or black. A pattern of metal contacts is imprinted on the surface to make electrical contact. When charged by the sun, this basic unit generates a dc photo voltage of 0.5 to 1 volt and in a short circuit, a photo current of some tens of milliamps per cm 2 . 2.3.2 Photovoltaic Generator Although the current is reasonable, the voltage is too small for most applications. To produce practical dc voltages the cells are connected together in series and encapsulated into modules. A module typically contains 28 to 36 cells in series, to generate a dc output voltage of 12 V in standard illumination conditions. 12 V modules can be used singly, or connected in parallel and series into an array with a larger current and voltage output. Cells within a module are integrated with bypass and blocking diodes in order to avoid the complete loss of power which would result if one cell in the series failed. Modules within arrays are similarly protected. The array, which is also called a photovoltaic generator, is designed to generate power at a certain current and voltage which is some multiple of 12 V, under standard illuminations. For almost all applications, the illumination is also a variable for efficient operation all the time and the photovoltaic generator must be integrated with a charge storage system (a battery) and with components for power regulation as shown in Figure 2.1. The battery is used to store charge generated during sunny periods and the power conditioning ensures that the power supply is regular and less sensitive to the solar irradiation. Power PV Load Conditioning 8 Figure 2.1 Photovoltaic array integrated with components for charge regulation and Storage Generator Storage [Battery (dc) or grid (ac)] 9 2.4 THE PHOTOVOLTAIC EFFECT Solar photovoltaic energy conversion is a one-step conversion process which generates electrical energy from light energy. The explanation relies on ideas from quantum theory. Light is made up of packets energy, called photons, whose energy only depends upon the frequency, or colour, of the light. When exposed to light photons with energy greater than the band gap energy of semiconductor are absorbed and create electron-hole pair. These carriers are swept apart under the influence of the internal electric fields of the p-n junction and create a current proportional to incident radiation. When the cell is short circuited, this current flows in the external circuit; when open circuited, this current is shunted internally by the intrinsic p-n junction diode. Normally, when light is absorbed by matter, photons are given up to excite electrons to higher energy states within the material, but the excited electrons relax quickly back to their ground state. In a photovoltaic device, however, there is some built-in asymmetry which pulls excited electrons away before they can loosen up, and feeds them to an external circuit. The extra energy of the excited electrons generates a potential difference, or electro-motive force (e.m.f). This force drives the electrons through a load in the external circuit to do electrical work. 2.5 SOME IMPORTANT DEFINITIONS Open circuit voltage: When a solar cell is switched on by light it develops a voltage or e.m.f. analogous to the e.m.f. of the battery. The voltage developed when the terminals are isolated (infinite load resistance) is called open circuit voltage V oc . Short circuit current: The current drawn when the terminals are connected together is called the short circuit current I sc . Since current is roughly proportional to the illuminated area, the short current density J sc is a useful quantity. For any intermediate load resistance R L the cell develops a voltage V between 0 and V oc and delivers a current I such that V= IR L and I(V) is determined by the current voltage characteristic of the cell under that illumination. A simple circuit of a solar cell is shown in Figure 2.2. Load solar cell Figure 2.2 A solar cell in a simple circuit Dark current density: When a load is present, a potential difference develops between the terminals of the cell. This potential difference develops between the terminals of the cell. This potential difference generates a current which acts in the opposite direction to the photocurrent, and net current is reduced 10 11 from its short circuit value. This reverse current is usually called dark current. For an ideal diode the dark current density J dark (V) varies like J dark (V) = Jo (eqV / kT 1) (2.1) where J o is a constant, k is Boltzmanns constant and T is the temperature in degrees Kelvin. Efficiency: The efficiency of the cell is the power density delivered at the operating point as a fraction of the incident light power density, P S . These four quantities J SC, V OC, FF and efficiency are the key performance characteristics of a solar cell. All of these should be defined for particular illumination conditions. The Standard Test Condition (STC) for solar cells is the Air Mass 1.5 spectrum, an incident power density of 1000 W m -2 , and a temperature of 25 o C. 2.6 EQUIVALENT CIRCUIT OF A SOLAR CELL 2.6.1 Ideal Solar Cell Electrically the solar cell is equivalent to a current generator in parallel with an asymmetric non-linear resistive element i.e. a diode. When illuminated, the ideal cell produces a photocurrent proportional to the light intensity. That photo current is divided between the variable resistance of the diode and the load. For higher resistances, more of the photocurrent flows through the diode, resulting in a higher potential difference between the cell terminals but smaller current through the load. The load thus provides the photo voltage. As per the equivalent circuit shown in Figure 2.3, without diode there is nothing to drive the photocurrent through the load. Figure 2.3 Equivalent circuit of an ideal solar cell 2.6.2 Parasitic Resistances In real cells, power is dissipated through the resistance of the contacts and leakage currents around the sides of the device. These effects are equivalent to two parasitic resistances in series (R se ) and in parallel (R sh ) with the cell. The series resistance arises from the resistance of the cell material to current flow and it is a particular problem at high current densities, for instance under concentrated light. The parallel or shunt resistance arises from the leakage of current through the cell and is a problem in poorly rectifying devices. Series and parallel resistance reduce the fill factor. For an efficient cell R S should be small and R SH as large as possible. From Figure 2.4, when parasitic resistances are included, the diode equation becomes J = J SC - J O ( e q ( V + JARs ) / kt ) 1 - ( V+JARs ) / R sh (2.2) 12 Figure 2.4 Equivalent circuit including series and shunt resistance 2.7 MATLAB MODEL OF A PV SYSTEM A single diode model is used for the modeling of PV module. The advantage of using PV module is that the direct conversion of light energy into electricity is directly possible and also it is static in nature. The PV cell has non- linear characteristics. The output voltage from the PV module depends on insolation and temperature gradient. A group of solar PV cells together form the PV power generation system. Equations (1)-(4) are used for the mathematical modeling of PV cell. The output current from PV panel is given as sh D ph pv I I I I (2.3) Photon generated current of the PV panel, I ph is given as n pvn n i ph G G I T T K I (2.4) The current through the diode is calculated as 13 1 V ) R I V ( exp I I ta se pv pv r D (2.5) and 1 ) ( exp ) ( ta ocn n v scn n i r V V T T K I T T K I (2.6) 2.8 SIMULATION OF PV MODULE The MATLAB-SIMULINK model for the PV panel is as shown in Figure 2.5 and the results are presented in Figure 2.6. Figure 2.5 MATLAB- Simulink diagram of PV module 14 Figure 2.6 V-I and P-V characteristics of PV module at STC Datasheet for a solar PV module available in lab (SOLKAR panel) is presented in Appendix. The characteristics for different illumination levels and different temperature conditions are presented in Figure 2.7 and Figure 2.8 respectively. Figure 2.7 Simulated V-I and V-P Characteristics of SPV module for Various Insolation at Constant Temperature T=25 0 C 15 Figure 2.8 Simulated V-I and V-P Characteristics of SPV module for Various Temperature at Constant Insolation G = 1000W/m 2 Thus the solar PV model was simulated using Simulink and the above mentioned results were obtained. 16 17 CHAPTER 3 DESIGN AND SIMULATION OF BUCK-BOOST CONVERTER 3.1 NEED FOR CONVERTERS In many industrial applications, it is required to convert a fixed voltage DC source into a variable voltage DC source. A DC-DC converter converts directly from dc to dc and is known as a DC converter. A dc converter can be considered as DC equivalent of an AC transformer with a continuously variable turns ratio. Like a transformer, it can be used to step down or step up a dc voltage source. DC converters are widely used for traction motor control in electric automobiles, trolley cars, marine hoists, forklift trucks and mine haulers. They provide smooth acceleration control, high efficiency and fast dynamic response. DC converters can be used in regenerative breaking of dc motors to return energy back to the supply, and this feature results in energy savings for transportation systems with frequent stops. DC converters are used in dc voltage regulators; and also are used, in conjunction with an inductor, to generate a dc current source, especially for current source inverter. DC-DC converter is nothing more than a DC transformer or a device that provides a loss less transfer of energy between different circuits at different voltage levels. When DC-DC conversion is needed there is also a need for control and a 18 need for higher efficiencies. If the latter were not important we could just use a voltage divider and get the change in voltage we are looking for. In modern dc electronics we need more than just voltage reduction. What really are needed are voltage transfers, polarity reversals, and increased and decreased voltages with control. One method of building a dc transformer is to use switching converters called choppers. The provided switching function requires a duty ratio, which will give us the control that has been needed. 3.2 TYPES OF CONVERTERS By the principle of operation, they are of two types of converters .They are 1. Step up converters 2. Step down converters The four basic topologies of converters are 1. Buck converters 2. Boost converters 3. Buck-boost converters 4. Cuk converters 3.3 CHOICE OF BUCK BOOST CONVERTER The choice of converter is based on constant charging current. Based on the duty cycle of converter it can operate in two modes basically 1. buck mode 2. boost mode 19 When the PV system is fed using battery, the system operates in buck mode When the PV system uses solar energy, it operates in boost mode 3.3.1 Operation of Buck-Boost Converter The buck boost converter is a type of dc-dc converter that has output voltage magnitude greater or lesser than input voltage magnitude. Two different topologies are called buck-boost converter. Both of them can produce a range of output voltages, from an output voltage much larger (in absolute magnitude) than the input voltage, down to almost zero. 3.3.2 The Inverting Topology The output voltage is opposite polarity of input. This is a switched mode power supply with a similar circuit topology to boost converter and buck converter. The output voltage is adjustable based on duty cycle of the switching transistor. One possible drawback of this converter is that the switch does not have a terminal at ground, this complicates driving circuitry. Neither drawback is of any consequence if power supply is isolated from the load circuit as the supply and diode polarity can simply be reversed. The switch can be either on ground side or on supply side. 3.3.3 A Buck Converter Followed By a Boost Converter The output polarity is of same polarity as input, can be lower or higher than input. Such a non-inverting buck boost converter may use a single inductor that is both used as buck inductor or boost inductor. Operation As shown in Figure 3.1, the output voltage polarity of buck boost regulator is opposite to that of input voltage. Hence it is also called inverting regulator. Figure 3.1 Circuit of buck-boost converter The switch used here is generally a MOSFET. The L, C and D are the filtering components. T is the transistor switch. The output current is shown negative. T is turned at t=0. It conducts from 0 to dt. Hence the current flows through inductance. Diode is reverse biased. Inductance stores the energy from 0 to dt. The current through inductor keeps on increasing. The capacitor discharges and supplies current to the load. Load current is assumed to be continuous and ripple free. The output voltage varies according to capacitor voltage. 20 At dT the transistor switch is turned off. Inductance generates the voltage L(di L /dt),this forward biases diode D. The inductance supplies energy to load from dT to T. Hence inductor current decreases. The capacitor is also charged. Hence its voltage also rises. The average output voltage is given as s o V D D V 1 Converter design equations are given as follows, f DR D L 2 ) 1 ( 1 fR 2 D C 1 Where R is the load of the converter, and D is the duty cycle of the converter. 3.4 SIMULATION OF BUCK-BOOST CONVERTER The Simulink model of the Buck-Boost converter is presented in the Figure 3.2. By varying the duty cycle, it is made to operate two modes. 21 Figure 3.2 Simulation of buck-boost converter 3.5 SIMULATION RESULTS OF BUCK-BOOST COVERTER The simulation of buck-boost converter was carried on using MATLAB- SIMULINK and the results are presented in Figure 3.3. (a) (b) Figure 3.3 Output characteristics of buck-boost converter The buck-boost converter was designed and simulated. 22 23 CHAPTER 4 DESIGN AND SIMULATION OF SINGLE PHASE INVERTER 4.1 NEED FOR INVERTER An inverter is an electrical device that converts direct current (DC) to alternating current (AC).The converted AC can be at any required voltage and frequency with the use of appropriate transformers, switching, and control circuits. Solid-state inverters have no moving parts and are used in a wide range of applications, from small switching power supplies in computers, to large electric utility high-voltage direct current applications that transport bulk power. Inverters are commonly used to supply AC power from DC sources such as solar panels or batteries. The inverter performs the opposite function of a rectifier. The output voltage waveform of the inverter can be square wave, quasi square wave or low distorted sine wave. The output voltage can be controlled with the help of drives of switches. The inverters can be classified as voltage source inverters or current source inverters. When input DC voltage remains constant, then it is called voltage source inverter (VSI) or voltage fed inverter. When input current is maintained constant, then it is called current source inverter (CSI) or current fed inverter (CFI). Sometimes, the DC input voltage to the inverter is controlled to adjust the output. Such inverters are called variable DC link inverters. 24 4.2 GENERAL CLASSIFICATION OF SINGLE PHASE INVERTERS 1. Half bridge inverter 2. Full bridge inverter Here for the sake of conversion of the DC voltage obtained from the buck-boost converter to an AC voltage in order to feed it to the induction motor, single phase inverter is considered. 4.3 FULL BRIDGE INVERTER The diodes are required for feedback when the load is inductive. Here for separate simulation of the inverter, a resistive load is used. When the load is resistive, does not carry any current. 4.3.1 Principle of Operation A Single phase bridge voltage source inverter is shown in Fig.1. It consists of four MOSFETS or say switches. When MOSFETS 1 and 2 are turned on simultaneously, the input voltage V dc appears across the load. If switches 3 and 4 are turned on at the same time, the voltage across the load is reversed and is V dc . The modes of conduction are shown from Figure.4.1 to Figure 4.4. The rms output voltage can be found from the following equation 2 2 0 2 2 o T si o oi dt V T V (4.1) Hence the output voltage of the inverter can be obtained theoretically and compared with the practical results. Mode – 1 (1, 2 conduct) 1 and 2 are applied to the drive at t=0. But they dont conduct until t 1 . Diodes, D1 and D2 conduct from 0 to t 1 . Figure 4.1 Mode1 operation of single phase inverter Hence 1 and 2 are reverse biased and they do not conduct. From t 1 to T/2, 1 and 2 conduct. The load current is positive and it increases from 0 to +I max . 25 Mode – 2 (D3 and D4 conduct) At T/2, switches 1 and 2 are turned off and 3 and 4 are applied drives. The load inductance (in case of RL load) generates a large voltage. The diodes D3 and D4 are forward biased due to the inductance voltage. These diodes conduct and output current flows through DC supply. This is called as feedback operation. Figure 4.2 Mode2 operation of single phase inverter There is negative current when D3 and D4 conduct and hence 3 and 4 are reverse biased and they dont conduct even though base drives are applied. When the load becomes zero say at t 2 3 and 4 start conducting. Mode – 3 (3 and 4 conduct) At t 2 the switches 3 and 4 start conducting. The output current is negative and increases to I max . 26 Figure 4.3 Mode3 operation of single phase inverter The supply current is positive and the output voltage is negative during this period. Mode – 4 (D1 and D2 conduct) At T, 3 and 4 are turned off and 1 and 2 are applied to the drive. The output current is I max. Hence load inductance generates large voltage. Due to this voltage the diodes D1 and D2 are forward biased. 27 Figure 4.4 Mode4 operation of single phase inverter Hence they start conducting. The load energy is fed back to DC supply whenever diodes conduct. The output voltage waveform is square wave having amplitudes of ±V dc.. 4.4 APPLICATIONS DC power source utilization, uninterruptible power supplies, induction heating, HVDC power transmission, variable frequency derives air conditioning etc. 4.5 MATLAB SIMULINK As explained above, a single phase inverter was modeled using the matlab simulink model and circuit is shown in the Figure 4.5. 28 Figure 4.5 Simulink model of single phase inverter 4.6 SIMULATION RESULTS Figure 4.6 shows the output voltage characteristics of the single phase inverter. Figure 4.6 Output voltage of single phase inverter Thus the modeling of inverter was completed. 29 30 CHAPTER 5 DESIGN AND SIMULATION OF SINGLE PHASE INDUCTION MOTOR 5.1 SINGLE PHASE INDUCTION MOTOR-AN INTRODUCTION An induction or asynchronous motor is a type of AC motor where power is supplied to the rotor by means of electromagnetic induction. These motors are widely used in industrial drives, particularly poly phase induction motors, because they are rugged and have no brushes. Single-phase versions are used in small appliances. Their speed is determined by the frequency of the supply current, so they are most widely used in constant-speed applications, although variable speed versions, using variable frequency drives are becoming more common. The most common type is the squirrel cage motor, and this term is sometimes used for induction motors generally. The characteristics of single phase induction motors are identical to 3-phase induction motors except that single phase induction motor has no inherent starting torque and some special arrangements have to be made for making it self-starting. It follows that during starting period the single phase induction motor has to be converted to a type which is not a single phase induction motor in the sense in which the term is ordinarily used and it becomes a true single phase induction motor when it is running and after the speed and torque have been raised to a point beyond which the additional device may be dispensed with. The starting device adds to the cost of the motor and also requires more space. Figure 5.1 Elementary single phase induction motor An induction motor with a cage rotor and a single phase stator winding is shown schematically in Figure 5.1. The actual stator winding is distributed in slots so as to produce an approximately sinusoidal space distribution of mmf. With regard to this project the main cause for the choice of an induction motor is, it has high efficiency when compared to conventional dc motors, also the optimal size and cost. The frequent speed control of induction motors is also possible. 5.2 PRINCIPLE OF OPERATION 5.2.1 Construction Similar to a DC motor single phase induction motor has basically two main parts, one rotating and other stationary. The stationary part is called stator while the rotating part is the rotor. The stator has a laminated construction, made up of stampings. The stampings are slotted on its periphery to carry the stator or the main winding. This is excited by a single phase supply. The stator winding is wound for certain definite number of poles means when excited by a single phase a.c supply, 31 stator produces a magnetic field which creates the effect of certain number. The number of poles for which the winding is wound decides the synchronous speed of the motor, denoted as Ns. Ns = (5.1) The induction motor never rotates in the synchronous speed but rotates at a speed which is slightly less than the synchronous speed. The rotor construction is of squirrel cage type. In this type, rotor consists of un-insulated copper or aluminium bars placed in the slots. The bars are permanently shorted at both the ends with the help of conducting rings called end rings. Since they are shorted the resistance is very small. The air gap between stator and rotor is kept uniform and as small as possible. The main feature of rotor is that it automatically adjusts itself for same number of poles as that of stator windings. 5.2.2 Working Principle For the motoring action there must exists two fluxes which interact with each other to produce the torque. In DC motors, field winding produces the main flux while DC supply given to the armature is responsible to produce armature flux. The main flux and the armature flux interact to produce the torque. In the single phase induction motor single phase AC supply is given to the stator winding. The stator winding carries an alternating current which produces the flux which is also alternating in nature. This flux is called the main flux. This 32 33 flux links with the rotor conductors and due to transformer action e.m.f. gets induced in the rotor. The induced e.m.f. drives current through the rotor as rotor circuit is closed circuit. This rotor current produces another flux called rotor flux required for the motoring action. Thus second flux is produced according to the induction principle due to induced e.m.f hence the motor is named so. The single phase is not self-starting which can be explained through the double field revolving theory. 5.2.3 Double Field Revolving Theory Any alternating quantity can be resolved into two rotating components which rotate in opposite directions and each having a magnitude as half of the maximum magnitude of the alternating quantity. In case of single phase induction motor, the stator winding produces an alternating magnetic field having maximum magnitude of m. According to this theory, two components of the stator flux , each having magnitude half of maximum magnitude of start flux. Both these components are rotating in the opposite direction at the synchronous speed which is dependent on frequency and stator poles. Let f is the forward component rotating in anticlockwise direction while b is the backward component rotating in anticlockwise direction. The resultant of these two fluxes at any instant gives the instantaneous value o the stator flux at that instant. As shown in Figure 5.2, the resultant of these two is the original flux. Figure 5.2 Flux Rotation Both the components are rotating and hence get cut by the rotor conductors. Due to cutting of flux, e.m.f gets induced in rotor which circulates rotor current. The rotor flux interacts with f to produce a torque in one particular direction say anticlockwise, while rotor flux interacts with backward component, b, to produce a torque in clockwise direction. At start, these two torques are equal in magnitude Figure 5.3 Torque-speed characteristic of a 1 phase induction motor taking into account the changes in flux and opposite in direction. Each torque tries to rotate the rotor in its own direction. Thus the net torque experienced by the rotor is zero at start and hence the single phase induction motors are not self-starting as represented by Figure 5.3. 34 35 5.3 STARTING OF SINGLE PHASE INDUCTION MOTORS The single phase motors are always classified based on their starting methods. Appropriate selection of these motors depends upon the starting and the torque requirements of the load, duty cycle, and limitations on the starting and the running current drawn from the supply by these motors. Following are the starting methods available. (a) Split-phase induction motor (b) Capacitor start induction motor (c) Permanent split-capacitor motor (d) Capacitor start-capacitor run motor (e) Shaded pole induction motor In this project, based on the water pump, the capacitor start induction motor has been opted. 5.3.1 Capacitor Start Induction Motor Capacitors are used to improve the starting and the running performance of the motors. The capacitor start induction motor is also a split phase induction motor. From Figure 5.4 it is inferred that a capacitor of a suitable value is added in series with the auxiliary winding through a switch such that I a the current in the auxiliary winding leads the current I m in the main coil by 90 degrees in time phase so that the starting torque is maximum for certain values of I a and I m . Since the two windings are displaced by 90 degrees, maximum torque is developed at start. However the auxiliary winding and the capacitor are disconnected after the motor has picked up speed of about 75% of the synchronous speed. The motor will start without any humming noise. However after the auxiliary winding is disconnected, there will be some noise. Figure 5.4 (a) connection; (b) phasor diagram at start Since the auxiliary winding and the capacitor are used intermittently, these can be designed for minimum cost. However, it is found that the best compromise among the factors of starting torque, starting current and costs results with a phase angle somewhat less than 90 degree between I a and I m. 5.4 SIMULATION OF CAPACITOR RUN INDUCTION MOTOR The double field revolving theory can be effectively used to obtain the equivalent circuit of a single phase induction. The method consists of determining the values of both the fields clockwise and anticlockwise at any given slip. When the two fields are known, the torque produced by each can be obtained. The difference between these two torques is, the net torque acting on the rotor. Certain tests are performed on the induction motor in order to obtain the required 36 37 .2) st equal to the synchronous speed in this condition. Hence lip is assumed be zero. .4.2 B rt circuit current. And this voltage can be adjusted y the help of auto transformer. .5 SIMULINK MODEL obtained resembles the transformer model. It is given the following Figure 5.5. parameters of the equivalent circuit. The tests conducted are no-load test or open circuit test and blocked rotor test or short circuit test 5.4.1 No-Load Test The test is conducted by rotating the motor without load. The input current, voltage and power are measured. W 0 = V 0 I 0 cos (5 The motor speed is almo s 5 locked Rotor Test In this test, the rotor is held still such that it will not rotate. A reduced voltage is applied to limit the sho b 5 The equivalent circuit in Figure 5.5 Simulink model of induction motor The equations used to derive the torque and speed of the equivalent circuit shown in Figure 5.5 are given as, P f = (I f ) 2 .
. Forward power equation (5.3) P f = (I b ) 2 .
. Backward power equation (5.4) f ; (5.5) T b = P b (5.6) erefore, the net torque is given in equation (7) T f = P Th 38 39 T = T f - T b (5.7) And also %efficiency = * 100 (5.8) .6 SIMULATION RESULTS calculated and they are plotted against speed as shown in Figure 5.6 and 5.7. 5 From the above equations [3] to [8] , torque and efficiency are Figure 5.6 T-N characteristics of single phase induction motor 40 racteristics of single phase induction motor a =5.9 ; L a =0.048H; X m =0.374H; R r =101 ; L r =3.21mH; s =0.64to1.2 he complete simulation circuit is shown in Figure 5.8. Induction motor parameters ¼ HP motor; R C T Figure 5.8 Overall Matlab Simulink circuit ce the software implementation was carried out using the MATLAB oftware. Hen s 41 CHAPTER 6 HARDWARE IMPLEMENTATION .1 GENERAL BLOCK DIAGRAM e and ost converter. i.e. the utput voltage of the PV module is fed to the converter. 6 As shown in the Figure 6.1 above, the PV module receives energy from th sunlight. This form of thermal energy is converted into electric energy through photovoltaic effect. This output voltage of the PV module is of very less value, needs to be boosted up. Here comes the usage of buck bo o Figure 6.1 Block diagram of Photovoltaic water pumping system motor, the voltage needs to be inverted. Hence the inverter gains its role. The dc Thus the voltage is boosted up to the desired value. Since we use an AC form of voltage is thus inverter and is fed into the induction motor which is connected to the pump in the same shaft. 6.2 OPTIONS CONSIDERED 6.2.1 Solar Array Specification of the photovoltaic module as shown in Figure 6.2 Voltage : 21.2V Current : 2.55A Power rating : 37W No. of cells/module : 36 cells No. of panels : 7 panels 3X3 Panel Board Electronic Load Solar Panels Electronic Load Figure 6.2 Arrangement of Solar PV Array 6.2.2 Converter A DC-DC converter is a device that accepts a DC input voltage and produces a DC output voltage. Typically the output produced is at a different 42 voltage level than the input. The converter we researched for the purpose considered in this project was a buck-boost converter. It starts at the lowest input voltage. The components used to design the hardware of the converter as shown in Figure 6.3. Mosfet : IRF460 Power Diode : 1N5408 Capacitor : 0.3µF, 60V Inductor : e-core type, 1.23mH 43 Power Circuit Control Circuit Figure 6.3 Hardware model of Buck-Boost converter The power circuit was made to operate in both the modes by varying the duty cycle and hence the voltage was made to boost. 6.2.3 DC Battery Source In order to the store the energy when the power is not utilized a battery source was included after the converter circuit. Hardware setup as shown in Figure 6.4 Ratings of the Battery: 600VA Figure 6.4 Inverter and battery set up 6.2.4 Inverter It is a device which converts the DC to AC. A single phase inverter which was available in the laboratory was utilized for this purpose. Ratings of the Inverter: 50 Hz 6.2.5 Single Phase Induction Motor For practical purpose the single phase induction motor available in the laboratory was made use. Hardware setup as shown in Figure 6.5 44 Ratings of the Motor: ¼ watt Figure 6.5(a) Water Pumping Arrangement Figure 6.5(b) Practical induction motor 6.2.6 Astable Multivibrator In order to count the number of water cycles the induction motor has pumped the astable multivibrator was utilized. At t 1 , the water begins to discharge 45 and t 2 is the time taken to complete the cycle, hence t1-t2 gives the time taken to fill up the volume of the tank. Components Used: Diode : 1N4007 Resistor : 10.1K , 4.37K Capacitor : 0.01µF, 0.1µF The hardware setup of astable multivibrator is as shown in Figure 6.6 Figure 6.6 PCB circuit of an astable multivibrator The circuit has been connected and the output pulses generated were verified. The output pulse was almost to be 4V. 46 6.2.7 Hardware Results The layout for the hardware setup of the PV pumping system is shown in Figure 6.7. Input to the boost converter is provided by the Solar Photo voltaic module. Figure 6.7 Entire setup of the PV water pumping system By inter connecting the system, the following results were obtained. The Voltage from the solar photovoltaic module was fed to the converter. The respective control pulses were obtained for the converter. As shown in Figure.8, astable multivibrator was connected to the induction motor. The pulses from the multi vibrator are shown in Figure 6.9. Thus according to the pulses (Figure 6.9), the beep sound appears whenever the water begins to discharge. 47 Figure 6.8 Setup of the Induction Motor and the pump. Figure 6.9 Astable multivibrator pulses 48 The control pulses for the converter generated from the PIC controller for various duty cycles are shown in Figure 6.10 (a) 70% duty cycle (b) 80% duty cycle Figure 6.10 PIC control pulses Thus when the MOSFET is triggered using the pulse as shown in Figure 6.10, the voltage is boosted up and is fed to the inverter. The generated output characteristics of inverter are shown in Figure 6.11 (a) (b) Figure 6.11 Inverter output voltage and Inverter output current 49 Under poor illumination conditions, battery can be used as a back-up. When the converter is to be operated in buck mode, the inverter gets its supply from the battery. The charging current and discharging current of the battery are shown in Figure 6.12. (a) (b) Figure 6.12 Battery charging current and Battery discharging current Figure 6.13 shows battery output voltage, which is fed to inverter under poor illumination conditions. 50 Figure 6.13 Battery output voltage The output voltage and current of the induction motor during the running condition are measured using the Digital Storage Oscilloscope and are shown in Figure 6.14 and Figure 6.15. The input to the induction motor is given from the inverter. (a) (b) Figure 6.14 Induction motor output current and output voltage 51 Figure 6.15 Induction motor output voltage and current 52 Thus the implementation of design, simulation and implementation of the photovoltaic water pumping system was carried out. As per the facilities available in the solar research lab, 9 photovoltaic panels were available, from which a total of 110V of voltage is obtained which was given to the converter circuit, which is boosted up to the level required by the inverter i.e. 230V approx. Then this voltage is given to the induction motor which drives the ¼ hp water pump and hence the water is pumped. Hence the theoretical and the practical results were made to co- ordinate. 53 CHAPTER 7 CONCLUSION AND SCOPE FOR FUTURE WORK 7.1 CONCLUSION In this project analysis of PV fed water pumping system has been carried out. To extract maximum power buck-boost converter is used. The outcome of the project is effective hydraulic storage. Though direct coupled dc motors with PV systems are already in use at present, an induction motor paves the way to achieve maximum efficiency. A battery is included in the system which stores energy when system is not in use. So even in case of pure sunlight conditions, this can serve the purpose. Though the power conversion capability of solar cell is limited, researches are being done to improve the same. In this project simulation results have been presented for low voltage levels but the concept can be extended to higher voltage levels with same inferences for industrial purpose. 7.2 FUTURE SCOPE The agricultural side of the world, particularly India, is facing much more problems due to the insufficient availability of technology. So the main idea of this project lies here. In order to develop an economical system of water pumping in rural or sub urban areas this project was developed. The induction motor could be further increased in its efficiency by many methods. Future researches in this area will definitely prove to be worthwhile. Since constant and rapid researches are performed to develop the solar panel into a more economical model, the solar energy would serve the future scope for electricity. APPENDIX I A 1.1 EXIDE POWERSAFE BATTERIES: Charge Parameters Charge Voltage Applications Temperature Cut-off Point Range Max Charge Current Cyclic Use 27 O C 14.7 14.6 - 14.8 0.2 CA Standby Use 27 O C 13.53 13.38 13.68 0.2 CA Temperature Compensation Coefficient : 5 mV/ O C (Cyclic)/-3mV/ O C(Standby) Ratings: Voltage: 12V Current: 100Ah Standby Use 13.6V 13.8V Cycle Use 14.6V - 14.8V Maximum Initial Current 20A Voltage Regulation 27 O C 54 55 A 1.2 MICROTEK UPS EV/E 2 MODELS: Technical Specifications Input Voltage 100V 300V(Wide Input Voltage Range) 180V 260V(Normal Input Voltage Range) Output Voltage On Mains Mode Same as input Output Voltage on UPS mode 200V 230V ± 10% Output Frequency on UPS Mode 50Hz ± 0.1Hz Switching from mains to UPS and from Automatic UPS to mains Output waveform on mains mode Same as Input Output waveform on UPS mode TPZi waveform(TRAPEZOIDAL WAVEFORM) Battery charging current Constant charging approx. 10% of the rated battery Current in AH Charger Constant current, constant wattage Efficiency EV models > 84% E 2 models > 87% UPS overload / UPS short circuit 110%/300% UPS transfer time 15ms 56 Browns out mains voltage 100V ± 40V Technology MICROCONTROLLER BASED DESIGN Auto Reset Feature Yes Front Panel LED Indications 1. Mains on 2. UPS on 3. Battery charging a. LED Continuously Glows When Charged b. LED Blinks When Battery Is Charging 4. Fuse Blown 5. UPS Overload 6. Battery Low Back Panel 1. Mains Input Terminal Block/Lead For AC Input 2. Circuit Breaker for mains overload / short circuit protection. (4Amps/6Amps for UPSE 2 275 / 400 Model, 6Amps / 7Amps for UPSEB / E 2 600 / 625 model, 8Amps/ 10 Amps for UPSEB / E 2 1400/1550 Model). 3. Output socket for load 4. Positive Battery Lead. 57 5. Negative Battery Lead 6. Slide Switch for Mains Input Voltage Range Selection 7. Slide Switch to Select the Maximum Charging Voltage. (This switch is not in UPSE 2 275/400 model) (HIGH = 14.2VDC / Standard(STD)=13.8VDC) Select the appropriate Voltae as recommended by the Battery Manufacturer/Supplier. CAUTION: Proper selection of switch position is recommended based on the battery manufacturers specifications, for proper backup and also to avoid any damage to the battery due to wrong selection. 8. Fuse ( 10Amp Slow Blow for UPSEB/E 2 600/625/850/875/1400/1550 models , 2Amp Slow Blow or UPSE 2 275/400 model) for Charger. A 1.3 SOLAR PANEL SPECIFICATIONS 1 Rated Power (P max ) 37.08W 2 Voltage at maximum power (V mp ) 16.56V 3 Current at maximum power (I mp ) 2.25A 4 Open Circuit Voltage (V oc ) 21.24V 5 Short Circuit Current (I sc ) 2.55A 6 Size of Solar module 990mm x 440mm 7 Total number of cells in series 36 8 Total number of cells in parallel 0 9 Cell arrangement(row x col) 6 x 6 1N4001 – 1N4007 1 of 4 © 2006 Won-Top Electronics Pb 1N4001 – 1N4007 1.0A STANDARD DIODE Features Diffused Junction Low Forward Voltage Drop High Current Capability A B A High Reliability High Surge Current Capability Mechanical Data C Case: DO-41, Molded Plastic D Terminals: Plated Leads Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band Weight: 0.35 grams (approx.) Mounting Position: Any Marking: Type Number Lead Free: For RoHS / Lead Free Version, Add “-LF” Suffix to Part Number, See Page 4 Maximum Ratings and Electrical Characteristics @T A =25°C unless otherwise specified Single Phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbol 1N 4001 1N 4002 1N 4003 1N 4004 1N 4005 1N 4006 1N 4007 Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 50 100 200 400 600 800 1000 V RMS Reverse Voltage VR(RMS) 35 70 140 280 420 560 700 V Average Rectified Output Current (Note 1) @T A = 75°C IO 1.0 A Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) IFSM 30 A Forward Voltage @I F = 1.0A VFM 1.0 V Peak Reverse Current @T A = 25°C At Rated DC Blocking Voltage @T A = 100°C IRM 5.0 50 µA Typical Junction Capacitance (Note 2) Cj 15 pF Typical Thermal Resistance Junction to Ambient (Note 1) R JA 50 °C/W Operating Temperature Range Tj -65 to +125 °C Storage Temperature Range TSTG -65 to +150 °C Note: 1. Leads maintained at ambient temperature at a distance of 9.5mm from the case 2. Measured at 1.0 MHz and Applied Reverse Voltage of 4.0V D.C. DO-41 Dim Min Max A 25.4 — B 4.06 5.21 C 0.71 0.864 D 2.00 2.72 All Dimensions in mm 1N4001 – 1N4007 2 of 4 © 2006 Won-Top Electronics 40 60 80 100 120 140 160 180 0 0.2 0.4 0.6 0.8 1.0 T , AMBlENT TEMFEFATUFE (ºC) Fig. 1 Forward Curreht Deratihg Curve A V , FEVEFSE VOLTAGE (V) Fig. 4 Typical Juhctioh Capacitahce F 1.0 10 100 1.0 10 100 T = 25ºC j f = 1MHz 1.0 10 100 NUMBEF OF CYCLES AT 60 Hz Fig. 3 Max Noh-Fepetitive Feak Fwd Surge Curreht 0.6 0.8 1.0 1.2 1.4 1.6 0.01 0.1 1.0 V , lNSTANTANEOUS FOFWAFD VOLTAGE (V) Fig. 2 Typical Forward Characteristics F 10 1N4001 – 1N4007 3 of 4 © 2006 Won-Top Electronics MARKING INFORMATION TAPING SPECIFICATIONS PACKAGING INFORMATION Packaging Reel Diameter / Box Size (mm) Quantity (PCS) Carton Size (mm) Quantity (PCS) Approx. Gross Weight (KG) TAPE & REEL 330 5,000 370 x 370 x 420 25,000 13.0 TAPE & BOX 255 x 75 x 150 5,000 400 x 273 x 415 50,000 21.0 BULK 198 x 84 x 20 1,000 459 x 214 x 256 50,000 19.5 Note: 1. Paper reel, white or gray color. Core material: plastic or metal. 2. Components are packed in accordance with EIA standard RS-296-E. TAPE & REEL Cathode = Polarity Band 1N400x = Device Number x = 1, 2, 3, 4, 5, 6 or 7 WTE = Manufacturer’s Logo 1N400x WTE 0.8mm MAX 5mm 1.2mm MAX 0.8mm MAX 6mm 52.4mm Cathode Tape: Red Anode Tape: White 330mm Product ID Label Inspection Hole (both ends) 80±5mm TAPE & BOX 255mm Product ID Label 150mm 75mm BULK 198mm 84mm 20mm 1N4001 – 1N4007 4 of 4 © 2006 Won-Top Electronics ORDERING INFORMATION Product No. Package Type Shipping Quantity 1N4001-T3 DO-41 5000/Tape & Reel 1N4001-TB DO-41 5000/Tape & Box 1N4001 DO-41 1000 Units/Box 1N4002-T3 DO-41 5000/Tape & Reel 1N4002-TB DO-41 5000/Tape & Box 1N4002 DO-41 1000 Units/Box 1N4003-T3 DO-41 5000/Tape & Reel 1N4003-TB DO-41 5000/Tape & Box 1N4003 DO-41 1000 Units/Box 1N4004-T3 DO-41 5000/Tape & Reel 1N4004-TB DO-41 5000/Tape & Box 1N4004 DO-41 1000 Units/Box 1N4005-T3 DO-41 5000/Tape & Reel 1N4005-TB DO-41 5000/Tape & Box 1N4005 DO-41 1000 Units/Box 1N4006-T3 DO-41 5000/Tape & Reel 1N4006-TB DO-41 5000/Tape & Box 1N4006 DO-41 1000 Units/Box 1N4007-T3 DO-41 5000/Tape & Reel 1N4007-TB DO-41 5000/Tape & Box 1N4007 DO-41 1000 Units/Box 1. Products listed in bold are WTE Preferred devices. 2. Shipping quantity given is for minimum packing quantity only. For minimum order quantity, please consult the Sales Department. 3. To order RoHS / Lead Free version (with Lead Free finish), add “-LF” suffix to part number above. For example, 1N4001-TB-LF. Won-Top Electronics Co., Ltd (WTE) has checked all information carefully and believes it to be correct and accurate. However, WTE cannot assume any responsibility for inaccuracies. Furthermore, this information does not give the purchaser of semiconductor devices any license under patent rights to manufacturer. WTE reserves the right to change any or all information herein without further notice. WARNING: DO NOT USE IN LIFE SUPPORT EQUIPMENT. WTE power semiconductor products are not authorized for use as critical components in life support devices or systems without the express written approval. Won-Top Electronics Co., Ltd. No. 44 Yu Kang North 3rd Road, Chine Chen Dist., Kaohsiung, Taiwan Phone: 886-7-822-5408 or 886-7-822-5410 Fax: 886-7-822-5417 Email:
[email protected] Internet: http://www.wontop.com 2003 Microchip Technology Inc. Advance Information DS39617A-page 1 PIC18F2455/2550/4455/4550 Universal Serial Bus Features: • USB V2.0 Compliant SIE • Low-speed (1.5 Mb/s) and full-speed (12 Mb/s) • Supports control, interrupt, isochronous and bulk transfers • Supports up to 32 endpoints (16 bidirectional) • 1-Kbyte dual access RAM for USB • On-board USB transceiver with on-chip voltage regulator • Interface for off-chip USB transceiver • Streaming Parallel Port (SPP) for USB streaming transfers (40/44-pin devices only) Power Managed Modes: • Run: CPU on, peripherals on • Idle: CPU off, peripherals on • Sleep: CPU off, peripherals off • Idle mode currents down to 5.8 A typical • Sleep current down to 0.1 A typical • Timer1 oscillator: 1.1 A typical, 32 kHz, 2V • Watchdog Timer: 2.1 A typical • Two-Speed Oscillator Start-up Flexible Oscillator Structure: • Five Crystal modes, including High-Precision PLL for USB • Two External RC modes, up to 4 MHz • Two External Clock modes, up to 40 MHz • Internal oscillator block: - 8 user selectable frequencies, from 31 kHz to 8 MHz - User tunable to compensate for frequency drift • Secondary oscillator using Timer1 @ 32 kHz • Fail-Safe Clock Monitor - Allows for safe shutdown if any clock stops Peripheral Highlights: • High current sink/source: 25 mA/25 mA • Three external interrupts • Four Timer modules (Timer0 to Timer3) • Up to 2 Capture/Compare/PWM (CCP) modules: - Capture is 16-bit, max. resolution 6.25 ns (TCY/16) - Compare is 16-bit, max. resolution 100 ns (TCY) - PWM output: PWM resolution is 1 to 10-bit • Enhanced Capture/Compare/PWM (ECCP) module: - Multiple output modes - Selectable polarity - Programmable dead-time - Auto-Shutdown and Auto-Restart • Addressable USART module: - LIN bus support • Master Synchronous Serial Port (MSSP) module supporting 3-wire SPI™ (all 4 modes) and I 2 C™ Master and Slave modes • 10-bit, up to 13-channels Analog-to-Digital Converter module (A/D) with programmable acquisition time • Dual analog comparators with input multiplexing Special Microcontroller Features: • C compiler optimized architecture with optional extended instruction set • 100,000 erase/write cycle Enhanced Flash program memory typical • 1,000,000 erase/write cycle data EEPROM memory typical • Flash/data EEPROM retention: > 40 years • Self-programmable under software control • Priority levels for interrupts • 8 x 8 Single Cycle Hardware Multiplier • Extended Watchdog Timer (WDT): - Programmable period from 41 ms to 131s • Programmable Code Protection • Single-supply 5V In-Circuit Serial Programming™ (ICSP™) via two pins • In-Circuit Debug (ICD) via two pins • Wide operating voltage range (2.0V to 5.5V) Device Program Memory Data Memory I/O 10-bit A/D (ch) CCP/ ECCP (PWM) SPP MSSP Timers 8/16-bit FLASH (bytes) # Single- Word Instructions SRAM (bytes) EEPROM (bytes) SPI Master I 2 C PIC18F2455 24K 12288 2048 256 24 10 2/0 No Y Y 1 2 1/3 PIC18F2550 32K 16384 2048 256 24 10 2/0 No Y Y 1 2 1/3 PIC18F4455 24K 12288 2048 256 35 13 1/1 Yes Y Y 1 2 1/3 PIC18F4550 32K 16384 2048 256 35 13 1/1 Yes Y Y 1 2 1/3 28/40/44-Pin High-Performance, Enhanced Flash USB Microcontrollers with nanoWatt Technology PIC18F2455/2550/4455/4550 DS39617A-page 2 Advance Information 2003 Microchip Technology Inc. Pin Diagrams RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4/AN11/KBI0/CSSPP RB3/AN9/CCP2*/VPO RB2/AN8/INT2/VMO RB1/AN10/INT1/SCK/SCL RB0/AN12/INT0/SDI/SDA VDD VSS RD7/SPP7/P1D RD6/SPP6/P1C RD5/SPP5/P1B RD4/SPP4 RC7/RX/DT/SDO RC6/TX/CK D+/VP D-/VM RD3/SPP3 RD2/SPP2 MCLR/VPP/RE3 RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT RA5/AN4/SS/LVDIN/C2OUT RE0/CK1SPP/AN5 RE1/CK2SPP/AN6 RE2/OESPP/AN7 AVDD AVSS OSC1/CLKI/RA7 OSC2/CLKO/RA6 RC0/T1OSO/T13CKI RC1/T1OSI/CCP2*/UOE RC2/CCP1/P1A VUSB RD0/SPP0 RD1/SPP1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 40-Pin PDIP 10 11 2 3 4 5 6 1 8 7 9 12 13 14 15 16 17 18 19 20 23 24 25 26 27 28 22 21 MCLR/VPP/RE3 RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT RA5/AN4/SS/LVDIN/C2OUT VSS OSC1/CLKI/RA7 OSC2/CLKO/RA6 RC0/T1OSO/T13CKI RC1/T1OSI/CCP2*/UOE RC2/CCP1 VUSB RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4/AN11/KBI0/RCV RB3/AN9/CCP2*/VPO RB2/AN8/INT2/VMO RB1/AN10/INT1/SCK/SCL RB0/AN12/INT0/SDI/SDA VDD VSS RC7/RX/DT/SDO RC6/TX/CK D+/VP D-/VM 28-Pin SDIP, SOIC Note: Pinouts are subject to change. * Assignment of this feature is dependent on device configuration. 2003 Microchip Technology Inc. Advance Information DS39617A-page 3 PIC18F2455/2550/4455/4550 Pin Diagrams (Continued) 44-Pin QFN 10 11 2 3 6 1 8 7 29 30 31 32 33 23 24 25 26 27 28 9 PIC18F4455 OSC2/CLKO/RA6 OSC1/CLKI/RA7 VSS AVDD RA5/AN4/SS/LVDIN/C2OUT RA4/T0CKI/C1OUT RC7/RX/DT/SDO RD4/CCP2*/P2A RD5/SSP5/P1B RD6/SSP6/P1C VSS VDD RB0/AN12/INT0/SDI RB1/AN10/INT1/SCK/SCL RB2/AN8/INT2/VMO RD7/SSP7/P1D 5 4 AVSS VDD AVDD 10 11 2 3 6 1 8 7 29 30 31 32 33 23 24 25 26 27 28 9 PIC18F4455 NC RC0/T1OSO/T13CKI OSC2/CLKO/RA6 OSC1/CLKI/RA7 VSS VDD RA5/AN4/SS/LVDIN/C2OUT RA4/T0CKI/C1OUT VSS VDD 44-Pin TQFP 5 4 PIC18F4550 RC7/RX/DT/SDO RD4/SPP4 RD5/SPP5/P1B RD6/SPP6/P1C RD7/SPP7/P1D RB0/AN12/INT0/SDI/SDA RB1/AN10/INT1/SCK/SCL RB2/AN8/INT2/VMO RB3/AN9/CCP2*/VPO Note: Pinouts are subject to change. * Assignment of this feature is dependent on device configuration. PIC18F4550 RE0/CK1SPP/AN5 RE1/CK2SPP/AN6 RE2/OESPP/AN7 RE0/CK1SPP/AN5 RE1/CK2SPP/AN6 RE2/OESPP/AN7 PIC18F2455/2550/4455/4550 DS39617A-page 4 Advance Information 2003 Microchip Technology Inc. NOTES: DS39617A-page 5 Advance Information 2003 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Accuron, Application Maestro, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In- Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. DS39617A-page 6 Advance Information 2003 Microchip Technology Inc. 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A. De Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340 United Kingdom 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 07/28/03 WORLDWIDE SALES AND SERVICE H6T2, H6T2E 0PT060uPLEP$ SOES023 – MARCH 1983 – REVISED OCTOBER 1995 1 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 COMPATIBLE WITH STANDARD TTL INTEGRATED CIRCUITS Gallium Arsenide Diode Infrared Source Optically Coupled to a Silicon npn Phototransistor High Direct-Current Transfer Ratio Base Lead Provided for Conventional Transistor Biasing High-Voltage Electrical Isolation . . . 1.5-kV, or 3.55-kV Rating Plastic Dual-In-Line Package High-Speed Switching: t r = 5 s, t f = 5 s Typical Designed to be Interchangeable with General Instruments MCT2 and MCT2E absolute maximum ratings at 25 C free-air temperature (unless otherwise noted) † Input-to-output voltage: MCT2 1.5 kV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MCT2E 3.55 kV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Collector-base voltage 70 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Collector-emitter voltage (see Note 1) 30 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Emitter-collector voltage 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Emitter-base voltage 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input-diode reverse voltage 3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input-diode continuous forward current 60 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input-diode peak forward current (t w 1 ns, PRF 300 Hz) 3 A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous power dissipation at (or below) 25 C free-air temperature: Infrared-emitting diode (see Note 2) 200 mW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Phototransistor (see Note 2) 200 mW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Total, infrared-emitting diode plus phototransistor (see Note 3) 250 mW . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating free-air temperature range, T A –55 C to 100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, T stg –55 C to 150 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. This value applies when the base-emitter diode is open-circulated. 2. Derate linearly to 100 C free-air temperature at the rate of 2.67 mW/ C. 3. Derate linearly to 100 C free-air temperature at the rate of 3.33 mW/ C. Copyright 1995, Texas Instruments Incorporated PP00u6T|0N 0ATA |nformat|on |s current as of pub||cat|on date. Products conform to spec|f|cat|ons per the terms of Texas |nstruments standard Warranty. Product|on process|ng does not necessar||y |nc|ude test|ng of a|| parameters. 1 2 3 6 5 4 ANODE CATHODE NC BASE COLLECTOR EMITTER MCT2 OR MCT2E . . . PACKAGE (TOP VIEW) NC – No internal connection H6T2, H6T2E 0PT060uPLEP$ SOES023 – MARCH 1983 – REVISED OCTOBER 1995 2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 electrical characteristics at 25 C free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT V (BR)CBO Collector-base breakdown voltage I C = 10 A, I E = 0, I F = 0 70 V V (BR)CEO Collector-emitter breakdown voltage I C =1 mA, I B = 0, I F = 0 30 V V (BRECO) Emitter-collector breakdown voltage I E = 100 A, I B = 0, I F = 0 7 V I R Input diode static reverse current V R = 3 V 10 A I C(on) On-state collector current Phototransistor operation V CE = 10 V, I B = 0, I F = 10 mA 2 5 mA C(on) Photodiode operation V CB = 10 V, I E = 0, I F = 10 mA 20 A I C(off) Off-state collector current Phototransistor operation V CE = 10 V, I B = 0, I F = 0 1 50 nA C(off) Photodiode operation V CB = 10 V, I E = 0, I F = 0 0.1 20 nA H FE Transistor static forward current transfer ratio V CE = 5 V, I C 100 A MCT2 250 H FE Transistor static forward current transfer ratio I C = 100 A, I F = 0 MCT2E 100 300 V F Input diode static forward voltage I F = 20 mA 1.25 1.5 V V CE(sat) Collector-emitter saturation voltage I C = 2 mA, I B = 0, I F = 16 mA 0.25 4 V r IO Input-to-output internal resistance V in-out = 1.5 kV for MCT2, 3.55 kV for MCT2E, See Note 4 10 11 C io Input-to-output capacitance V in-out = 0, See Note 4 f = 1 MHz, 1 pF NOTE 4: These parameters are measured between both input diode leads shorted together and all the phototransistor leads shorted together. switching characteristics PARAMETER TEST CONDITIONS MIN TYP MAX UNIT t r Rise time Phototransistor operation V CC = 10 V, I C(on) = 2 mA, 5 s t f Fall time Phototransistor operation CC , R L = 100 , C(on) , See Test Circuit A of Figure 1 5 s t r Rise time Photodiode operation V CC = 10 V, I C(on) 20 A, 1 s t f Fall time Photodiode operation CC R L = 1 k , C(on) See Test Circuit B of Figure 1 1 s H6T2, H6T2E 0PT060uPLEP$ SOES023 – MARCH 1983 – REVISED OCTOBER 1995 3 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 PARAMETER MEASUREMENT INFORMATION TEST CIRCUIT A PHOTOTRANSISTOR OPERATION + – V CC = 10 V Input Output (see Note B) R L = 100 47 + – V CC = 10 V Input Output (see Note B) R L = 1 k 47 t r t f 90% 10% 90% 10% Output Input 0 V TEST CIRCUIT B PHOTODIODE OPERATION VOLTAGE WAVEFORMS NOTES: A. The input waveform is supplied by a generator with the following characteristics: Z O = 50 t r 15 ns, duty cycle 1%, t w = 100 s. B. The output waveform is monitored on an oscilloscope with the following characteristics: t r 12 ns, R in 1 M C in 20 pF. Figure 1. Switching Times H6T2, H6T2E 0PT060uPLEP$ SOES023 – MARCH 1983 – REVISED OCTOBER 1995 4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 TYPICAL CHARACTERISTICS 0.04 0.01 0.1 0.1 0.4 1 4 10 40 100 COLLECTOR CURRENT vs INPUT-DIODE FORWARD CURRENT 0.4 1 4 10 40 100 I F – Input-Diode Forward Current – mA V CE = 10 V I B = 0 T A = 25 C Figure 2 Figure 3 30 20 10 0 0 2 4 6 8 10 12 40 50 COLLECTOR CURRENT vs COLLECTOR-EMITTER VOLTAGE 60 14 16 18 20 V CE – Collector-Emitter Voltage – V Max Continuous Power Dissipation I F = 40 mA I F = 30 mA I F = 20 mA I F = 20 mA I B = 0 T A = 25 C See Note A NOTE A: Pulse operation of input diode is required for operation beyond limits shown by dotted lines. 0.8 0.4 0.2 0 1.2 1.4 1.6 1 0.6 –75 –50 –25 0 25 50 75 100 125 T A – Free-Air Temperature – C V CE = 0.4 V to 10 V I B = 0 I F = 10 mA See Note B NOTE B: These parameters were measured using pulse techniques, t w = 1 ms, duty cycle 2 %. ON-STATE COLLECTOR CURRENT (RELATIVE TO VALUE AT 25 C) vs FREE-AIR TEMPERATURE Figure 4 H6T2, H6T2E 0PT060uPLEP$ SOES023 – MARCH 1983 – REVISED OCTOBER 1995 5 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 MECHANICAL INFORMATION The package consists of a gallium-arsenide infrared-emitting diode and an npn silicon phototransistor mounted on a 6-lead frame encapsulated within an electrically nonconductive plastic compound. The case can withstand soldering temperature with no deformation and device performance characteristics remain stable when operated in high-humidity conditions. Unit weight is approximately 0.52 grams. C L C 0,534 (0.021) 0,381 (0.015) 6 Places Seating Plane L 7,62 (0.300) T.P. 6,61 (0.260) 6,09 (0.240) 0,305 (0.012) 0,203 (0.008) 3,81 (0.150) 3,17 (0.125) 5,46 (0.215) 2,92 (0.115) 1,78 (0.070) 0,51 (0.020) 2,29 (0.090) 1,27 (0.050) 2,54 (0.100) T.P. (see Note A) 1,01 (0.040) MIN 1,78 (0.070) MAX 6 Places 9,40 (0.370) 8,38 (0.330) Index Dot (see Note B) 105 90 1 2 3 6 5 4 (see Note C) NOTES: A. Leads are within 0,13 (0.005) radius of true position (T.P.) with maximum material condition and unit installed. B. Pin 1 identified by index dot. C. Terminal connections: 1. Anode (part of the infrared-emitting diode) 2. Cathode (part of the infrared-emitting diode) 3. No internal connection 4. Emitter (part of the phototransistor) 5. Collector (part of the phototransistor) 6. Base (part of the phototransistor) D. The dimensions given fall within JEDEC MO-001 AM dimensions. E. All linear dimensions are given in millimeters and parenthetically given in inches. Figure 5. Mechanical Information PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) MCT2 OBSOLETE PDIP N 6 TBD Call TI Call TI MCT2E OBSOLETE PDIP N 6 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI’s terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI’s knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Copyright © Intersil Americas Inc. 2002, 2004, 2005, 2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ICM7555, ICM7556 General Purpose Timers The ICM7555 and ICM7556 are CMOS RC timers providing significantly improved performance over the standard SE/NE 555/6 and 355 timers, while at the same time being direct replacements for those devices in most applications. Improved parameters include low supply current, wide operating supply voltage range, low THRESHOLD, TRIGGER and RESET currents, no crowbarring of the supply current during output transitions, higher frequency performance and no requirement to decouple CONTROL VOLTAGE for stable operation. Specifically, the ICM7555 and ICM7556 are stable controllers capable of producing accurate time delays or frequencies. The ICM7556 is a dual ICM7555, with the two timers operating independently of each other, sharing only V+ and GND. In the one shot mode, the pulse width of each circuit is precisely controlled by one external resistor and capacitor. For astable operation as an oscillator, the free running frequency and the duty cycle are both accurately controlled by two external resistors and one capacitor. Unlike the regular bipolar SE/NE 555/6 devices, the CONTROL VOLTAGE terminal need not be decoupled with a capacitor. The circuits are triggered and reset on falling (negative) waveforms, and the output inverter can source or sink currents large enough to drive TTL loads, or provide minimal offsets to drive CMOS loads. Features • Exact Equivalent in Most Cases for SE/NE555/556 or TLC555/556 • Low Supply Current - ICM7555. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 A - ICM7556. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 A • Extremely Low Input Currents . . . . . . . . . . . . . . . . . 20pA • High Speed Operation . . . . . . . . . . . . . . . . . . . . . . . 1MHz • Guaranteed Supply Voltage Range . . . . . . . . . 2V to 18V • Temperature Stability . . . . . . . . . . . . 0.005%/°C at +25°C • Normal Reset Function - No Crowbarring of Supply During Output Transition • Can be Used with Higher Impedance Timing Elements than Regular 555/6 for Longer RC Time Constants • Timing from Microseconds through Hours • Operates in Both Astable and Monostable Modes • Adjustable Duty Cycle • High Output Source/Sink Driver can Drive TTL/CMOS • Outputs have Very Low Offsets, HI and LO • Pb-Free Plus Anneal Available (RoHS Compliant) Applications • Precision Timing • Pulse Generation • Sequential Timing • Time Delay Generation • Pulse Width Modulation • Pulse Position Modulation • Missing Pulse Detector Pinouts ICM7555 (8 LD PDIP, SOIC) TOP VIEW ICM7556 (14 LD PDIP, CERDIP) TOP VIEW GND TRIGGER OUTPUT RESET 1 2 3 4 8 7 6 5 V DD DISCHARGE THRESHOLD CONTROL VOLTAGE DISCHARGE THRESH- CONTROL RESET OUTPUT TRIGGER GND V DD DISCHARGE THRESHOLD CONTROL RESET OUTPUT TRIGGER 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VOLTAGE VOLTAGE OLD Data Sheet August 24, 2006 2 FN2867.9 August 24, 2006 Ordering Information PART NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE PKG. DWG. # ICM7555CBA 7555 CBA 0 to +70 8 Ld SOIC M8.15 ICM7555CBA-T 7555 CBA 0 to +70 8 Ld SOIC Tape and Reel M8.15 ICM7555CBAZ (Note) 7555 CBAZ 0 to +70 8 Ld SOIC (Pb-free) M8.15 ICM7555CBAZ-T (Note) 7555 CBAZ 0 to +70 8 Ld SOIC (Pb-free) Tape and Reel M8.15 ICM7555IBA 7555 IBA -25 to +85 8 Ld SOIC M8.15 ICM7555IBAT 7555 IBA -25 to +85 8 Ld SOIC Tape and Reel M8.15 ICM7555IBAZ (Note) 7555 IBAZ -25 to +85 8 Ld SOIC (Pb-free) M8.15 ICM7555IBAZ-T (Note) 7555 IBAZ -25 to +85 8 Ld SOIC (Pb-free) Tape and Reel M8.15 ICM7555IPA 7555 IPA -25 to +85 8 Ld PDIP E8.3 ICM7555IPAZ (Note) 7555 IPAZ -25 to +85 8 Ld PDIP** (Pb-free) E8.3 ICM7556IPD ICM7556IPD -25 to +85 14 Ld PDIP E14.3 ICM7556IPDZ (Note) ICM7556IPDZ -25 to +85 14 Ld PDIP** (Pb-free) E14.3 ICM7556MJD ICM7556MJD -55 to +125 14 Ld Cerdip F14.3 **Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. ICM7555, ICM7556 3 FN2867.9 August 24, 2006 Absolute Maximum Ratings Thermal Information Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+18V Input Voltage Trigger, Control Voltage, Threshold, Reset (Note 1) . . . . . . . . . . . . . . . . . . . . . V+ +0.3V to GND -0.3V Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA Operating Conditions Temperature Range ICM7555C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C ICM7555I, ICM7556I . . . . . . . . . . . . . . . . . . . . . . -25°C to +85°C ICM7556M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C Thermal Resistance (Typical, Note 2) JA (°C/W) JC (°C/W) 14 Lead CERDIP Package. . . . . . . . . . 80 24 14 Lead PDIP Package* . . . . . . . . . . . 115 N/A 8 Lead PDIP Package* . . . . . . . . . . . . 130 N/A 8 Lead SOIC Package . . . . . . . . . . . . . 170 N/A Maximum Junction Temperature (Hermetic Package) . . . . . . . +175°C Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . -65°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C (SOIC - Lead Tips Only) * Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. Due to the SCR structure inherent in the CMOS process used to fabricate these devices, connecting any terminal to a voltage greater than V+ +0.3V or less than V- -0.3V may cause destructive latchup. For this reason it is recommended that no inputs from external sources not operating from the same power supply be applied to the device before its power supply is established. In multiple supply systems, the supply of the ICM7555 and ICM7556 must be turned on first. 2. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief 379 for details. Electrical Specifications Applies to ICM7555 and ICM7556, unless otherwise specified PARAMETER SYMBOL TEST CONDITIONS T A = +25°C (NOTE 4) -55°C TO 125°C UNITS MIN TYP MAX MIN TYP MAX Static Supply Current I DD ICM7555 V DD = 5V 40 200 300 A V DD = 15V 60 300 300 A ICM7556 V DD = 5V 80 400 600 A V DD = 15V 120 600 600 A Monostable Timing Accuracy R A = 10K, C = 0.1 F, V DD = 5V 2 % 858 1161 s Drift with Temperature (Note 3) V DD = 5V 150 ppm/°C V DD = 10V 200 ppm/°C V DD = 15V 250 ppm/°C Drift with Supply (Note 3) V DD = 5V to 15V 0.5 0.5 %/V Astable Timing Accuracy R A = R B = 10K, C = 0.1 F, V DD = 5V 2 % 1717 2323 s Drift with Temperature (Note 3) V DD = 5V 150 ppm/°C V DD = 10V 200 ppm/°C V DD = 15V 250 ppm/°C Drift with Supply (Note 3) V DD = 5V to 15V 0.5 0.5 %/V Threshold Voltage V TH V DD = 15V 62 67 71 61 72 % V DD Trigger Voltage V TRIG V DD = 15V 28 32 36 27 37 % V DD Trigger Current I TRIG V DD = 15V 10 50 nA Threshold Current I TH V DD = 15V 10 50 nA Control Voltage V CV V DD = 15V 62 67 71 61 72 % V DD ICM7555, ICM7556 4 FN2867.9 August 24, 2006 Functional Diagram Reset Voltage V RST V DD = 2V to 15V 0.4 1.0 0.2 1.2 V Reset Current I RST V DD = 15V 10 50 nA Discharge Leakage I DIS V DD = 15V 10 50 nA Output Voltage V OL V DD = 15V, I SINK = 20mA 0.4 1.0 1.25 V V DD = 5V, I SINK = 3.2mA 0.2 0.4 0.5 V V OH V DD = 15V, I SOURCE = 0.8mA 14.3 14.6 14.2 V V DD = 5V, I SOURCE = 0.8mA 4.0 4.3 3.8 V Discharge Output Voltage V DIS V DD = 5V, I SINK = 15mA 0.2 0.4 0.6 V V DD = 15V, I SINK = 15mA 0.4 V Supply Voltage (Note 3) V DD Functional Operation 2.0 18.0 3.0 16.0 V Output Rise Time (Note 3) t R R L = 10M, C L = 10pF, V DD = 5V 75 ns Output Fall Time (Note 3) t F R L = 10M, C L = 10pF, V DD = 5V 75 ns Oscillator Frequency (Note 3) f MAX V DD = 5V, R A = 470 , R B = 270 , C = 200pF 1 MHz NOTES: 3. These parameters are based upon characterization data and are not tested. 4. Applies only to military temperature range product (M suffix). Electrical Specifications Applies to ICM7555 and ICM7556, unless otherwise specified (Continued) PARAMETER SYMBOL TEST CONDITIONS T A = +25°C (NOTE 4) -55°C TO 125°C UNITS MIN TYP MAX MIN TYP MAX + - THRESHOLD CONTROL VOLTAGE 6 5 3 1 + - TRIGGER 2 COMPARATOR R GND B COMPARATOR A R V DD 8 OUTPUT 7 1 n DISCHARGE OUTPUT DRIVERS FLIP-FLOP RESET 4 R NOTE: This functional diagram reduces the circuitry down to its simplest equivalent components. Tie down unused inputs. TRUTH TABLE THRESHOLD VOLTAGE TRIGGER VOLTAGE RESET OUTPUT DISCHARGE SWITCH Don’t Care Don’t Care Low Low On > 2 / 3 (V+) > 1 / 3 (V+) High Low On < 2 / 3 (V+) > 1 / 3 (V+) High Stable Stable Don’t Care < 1 / 3 (V+) High High Off NOTE: RESET will dominate all other inputs: TRIGGER will dominate over THRESHOLD. ICM7555, ICM7556 5 FN2867.9 August 24, 2006 Schematic Diagram Application Information General The ICM7555 and ICM7556 devices are, in most instances, direct replacements for the NE/SE 555/6 devices. However, it is possible to effect economies in the external component count using the ICM7555 and ICM7556. Because the bipolar NE/SE 555/6 devices produce large crowbar currents in the output driver, it is necessary to decouple the power supply lines with a good capacitor close to the device. The ICM7555 and ICM7556 devices produce no such transients. See Figure 1. The ICM7555 and ICM7556 produce supply current spikes of only 2mA - 3mA instead of 300mA - 400mA and supply decoupling is normally not necessary. Also, in most instances, the CONTROL VOLTAGE decoupling capacitors are not required since the input impedance of the CMOS comparators on chip are very high. Thus, for many applications, two capacitors can be saved using an ICM7555 and three capacitors with an ICM7556. POWER SUPPLY CONSIDERATIONS Although the supply current consumed by the ICM7555 and ICM7556 devices is very low, the total system supply current can be high unless the timing components are high impedance. Therefore, use high values for R and low values for C in Figures 2A, 2B, and 3. RESET DISCHARGE TRIGGER THRESHOLD GND OUTPUT CONTROL VOLTAGE R N N NPN P R R V DD N N N N N P P N N P P P R = 100k 20% (TYP) TIME (ns) 400 800 600 200 0 0 100 200 300 400 500 SE/NE555 T A = 25°C ICM7555/56 FIGURE 1. SUPPLY CURRENT TRANSIENT COMPARED WITH A STANDARD BIPOLAR 555 DURING AN OUTPUT TRANSITION GND TRIGGER RESET 1 2 3 4 8 7 6 5 V DD DISCHARGE THRESHOLD CONTROL VOLTAGE V DD 10K OPTIONAL CAPACITOR C V DD R FIGURE 2A. ASTABLE OPERATION ICM7555, ICM7556 6 FN2867.9 August 24, 2006 OUTPUT DRIVE CAPABILITY The output driver consists of a CMOS inverter capable of driving most logic families including CMOS and TTL. As such, if driving CMOS, the output swing at all supply voltages will equal the supply voltage. At a supply voltage of 4.5V or more, the ICM7555 and ICM7556 will drive at least two standard TTL loads. ASTABLE OPERATION The circuit can be connected to trigger itself and free run as a multivibrator, see Figure 2A. The output swings from rail to rail, and is a true 50% duty cycle square wave. (Trip points and output swings are symmetrical.) Less than a 1% frequency variation is observed over a voltage range of +5V to +15V. The timer can also be connected as shown in Figure 2B. In this circuit, the frequency is: The duty cycle is controlled by the values of R A and R B , by the equation: MONOSTABLE OPERATION In this mode of operation, the timer functions as a one-shot. See Figure 3. Initially the external capacitor (C) is held discharged by a transistor inside the timer. Upon application of a negative TRIGGER pulse to pin 2, the internal flip-flop is set which releases the short circuit across the external capacitor and drives the OUTPUT high. The voltage across the capacitor now increases exponentially with a time constant t = R A C. When the voltage across the capacitor equals 2 / 3 V+, the comparator resets the flip-flop, which in turn discharges the capacitor rapidly and also drives the OUTPUT to its low state. TRIGGER must return to a high state before the OUTPUT can return to a low state. CONTROL VOLTAGE The CONTROL VOLTAGE terminal permits the two trip voltages for the THRESHOLD and TRIGGER internal comparators to be controlled. This provides the possibility of oscillation frequency modulation in the astable mode or even inhibition of oscillation, depending on the applied voltage. In the monostable mode, delay times can be changed by varying the applied voltage to the CONTROL VOLTAGE pin. RESET The RESET terminal is designed to have essentially the same trip voltage as the standard bipolar 555/6, i.e., 0.6V to 0.7V. At all supply voltages it represents an extremely high input impedance. The mode of operation of the RESET function is, however, much improved over the standard bipolar NE/SE 555/6 in that it controls only the internal flip- flop, which in turn controls simultaneously the state of the OUTPUT and DISCHARGE pins. This avoids the multiple threshold problems sometimes encountered with slow falling edges in the bipolar devices. OUTPUT 1 2 3 4 8 7 6 5 V DD OPTIONAL CAPACITOR C V DD R A R B FIGURE 2B. ALTERNATE ASTABLE CONFIGURATION f 1 1.4 RC ------------------ ÷ (EQ. 1) f 1.44 R A 2R B ¹ C ÷ (EQ. 2) D R A R B ¹ R A 2R B ¹ ÷ (EQ. 3) TRIGGER OUTPUT RESET 1 2 3 4 8 7 6 5 V DD DISCHARGE THRESHOLD CONTROL VOLTAGE OPTIONAL CAPACITOR C V DD 18V R A ICM7555 t OUTPUT = -ln (1/3) R A C = 1.1R A C FIGURE 3. MONOSTABLE OPERATION ICM7555, ICM7556 7 FN2867.9 August 24, 2006 Typical Performance Curves FIGURE 4. MINIMUM PULSE WIDTH REQUIRED FOR TRIGGERING FIGURE 5. SUPPLY CURRENT vs SUPPLY VOLTAGE FIGURE 6. OUTPUT SOURCE CURRENT vs OUTPUT VOLTAGE FIGURE 7. OUTPUT SINK CURRENT vs OUTPUT VOLTAGE FIGURE 8. OUTPUT SINK CURRENT vs OUTPUT VOLTAGE FIGURE 9. OUTPUT SINK CURRENT vs OUTPUT VOLTAGE T A = 25°C V DD = 2V V DD = 18V LOWEST VOLTAGE LEVEL OF TRIGGER PULSE (%V DD ) V DD = 5V 0 10 20 30 40 0 1200 1100 1000 900 800 700 600 500 400 300 200 100 SUPPLY VOLTAGE (V) T A = 25°C T A = -20°C T A = 70°C 0 2 4 6 8 10 12 14 16 18 20 0 200 180 160 140 120 100 80 60 40 20 400 360 320 280 240 200 160 120 80 40 0 T A = 25°C V DD = 2V V DD = 5V V DD = 18V -100 -10.0 -1.0 -0.1 -0.01 -0.1 -1.0 -10 OUTPUT VOLTAGE REFERENCED TO V DD (V) T A = -20°C OUTPUT LOW VOLTAGE (V) V DD = 2V V DD = 5V V DD = 18V 0.01 0.1 1.0 10.0 0.1 100 10.0 1.0 T A = 25°C OUTPUT LOW VOLTAGE (V) V DD = 2V V DD = 5V V DD = 18V 0.01 0.1 1.0 10.0 0.1 100 10.0 1.0 T A = 70°C OUTPUT LOW VOLTAGE (V) V DD = 2V V DD = 5V V DD = 18V 0.01 0.1 1.0 10.0 0.1 100 10.0 1.0 ICM7555, ICM7556 8 FN2867.9 August 24, 2006 FIGURE 10. NORMALIZED FREQUENCY STABILITY IN THE ASTABLE MODE vs SUPPLY VOLTAGE FIGURE 11. DISCHARGE OUTPUT CURRENT vs DISCHARGE OUTPUT VOLTAGE FIGURE 12. PROPAGATION DELAY vs VOLTAGE LEVEL OF TRIGGER PULSE FIGURE 13. NORMALIZED FREQUENCY STABILITY IN THE ASTABLE MODE vs TEMPERATURE FIGURE 14. FREE RUNNING FREQUENCY vs R A , R B AND C FIGURE 15. TIME DELAY IN THE MONOSTABLE MODE vs R A AND C Typical Performance Curves (Continued) SUPPLY VOLTAGE (V) T A = 25°C R A = R B = 10M 0.1 1.0 10.0 100.0 8 8 6 4 2 0 2 4 6 C = 100pF R A = R B = 10k C = 0.1 F T A = 25°C DISCHARGE LOW VOLTAGE (V) V DD = 2V V DD = 5V V DD = 18V 0.01 0.1 1.0 10.0 0.1 100 10.0 1.0 T A = 25°C LOWEST VOLTAGE LEVEL OF TRIGGER PULSE (%V DD ) V DD = 5V 0 10 20 30 40 0 600 500 400 300 200 100 T A = 70°C T A = -20°C TEMPERATURE (°C) 0 60 80 -0.1 +0.1 0 R A = R B = 10k C = 0.1 F 40 20 -20 +0.2 +0.3 +0.4 +0.5 +0.6 +0.7 +0.8 +0.9 +1.0 V DD = 2V V DD = 5V V DD = 18V V DD = 2V T A = 25°C FREQUENCY (Hz) (R A + 2R B ) 1k 10k 100k 1M 10M 100M 10 0.1 1 100 1k 10k 100k 1M 10M 1.0 100m 10m 1m 100 10 1 100n 10n 1n 100p 10p 1p TIME DELAY (s) 1k 10k 100k 1M 10M 100M 10 100n 1 100 1m 10m 100m 1 10 1.0 100m 10m 1m 100 10 1 100n 10n 1n 100p 10p 1p R A T A = 25°C ICM7555, ICM7556 9 FN2867.9 August 24, 2006 ICM7555, ICM7556 Small Outline Plastic Packages (SOIC) INDEX AREA E D N 1 2 3 -B- 0.25(0.010) C A M B S e -A- L B M -C- A1 A SEATING PLANE 0.10(0.004) h x 45° C H 0.25(0.010) B M M NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Inter- lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.1890 0.1968 4.80 5.00 3 E 0.1497 0.1574 3.80 4.00 4 e 0.050 BSC 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 N 8 8 7 0° 8° 0° 8° - Rev. 1 6/05 10 FN2867.9 August 24, 2006 ICM7555, ICM7556 Dual-In-Line Plastic Packages (PDIP) C L E e A C e B e C -B- E1 INDEX 1 2 3 N/2 N AREA SEATING BASE PLANE PLANE -C- D1 B1 B e D D1 A A2 L A 1 -A- 0.010 (0.25) C A M B S NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protru- sions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and are measured with the leads constrained to be per- pendicular to datum . 7. e B and e C are measured at the lead tips with the leads uncon- strained. e C must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). e A -C- E8.3 (JEDEC MS-001-BA ISSUE D) 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - B1 0.045 0.070 1.15 1.77 8, 10 C 0.008 0.014 0.204 0.355 - D 0.355 0.400 9.01 10.16 5 D1 0.005 - 0.13 - 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC 2.54 BSC - e A 0.300 BSC 7.62 BSC 6 e B - 0.430 - 10.92 7 L 0.115 0.150 2.93 3.81 4 N 8 8 9 Rev. 0 12/93 11 FN2867.9 August 24, 2006 ICM7555, ICM7556 Dual-In-Line Plastic Packages (PDIP) NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and are measured with the leads constrained to be perpen- dicular to datum . 7. e B and e C are measured at the lead tips with the leads uncon- strained. e C must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). e A -C- C L E e A C e B e C -B- E1 INDEX 1 2 3 N/2 N AREA SEATING BASE PLANE PLANE -C- D1 B1 B e D D1 A A2 L A1 -A- 0.010 (0.25) C A M B S E14.3 (JEDEC MS-001-AA ISSUE D) 14 LEAD DUAL-IN-LINE PLASTIC PACKAGE SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - B1 0.045 0.070 1.15 1.77 8 C 0.008 0.014 0.204 0.355 - D 0.735 0.775 18.66 19.68 5 D1 0.005 - 0.13 - 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC 2.54 BSC - e A 0.300 BSC 7.62 BSC 6 e B - 0.430 - 10.92 7 L 0.115 0.150 2.93 3.81 4 N 14 14 9 Rev. 0 12/93 12 All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN2867.9 August 24, 2006 ICM7555, ICM7556 Ceramic Dual-In-Line Frit Seal Packages (CERDIP) NOTES: 1. Index area: A notch or a pin one identification mark shall be locat- ed adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. This dimension allows for off-center lid, meniscus, and glass overrun. 6. Dimension Q shall be measured from the seating plane to the base plane. 7. Measure dimension S1 at all four corners. 8. N is the maximum number of terminal positions. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. bbb C A - B S c Q L A SEATING BASE D PLANE PLANE -D- -A- -C- -B- D E S1 b2 b A e M c1 b1 (c) (b) SECTION A-A BASE LEAD FINISH METAL eA/2 A M S S ccc C A - B M D S S aaa C A - B M D S S eA F14.3 MIL-STD-1835 GDIP1-T14 (D-1, CONFIGURATION A) 14 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A - 0.200 - 5.08 - b 0.014 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 D - 0.785 - 19.94 5 E 0.220 0.310 5.59 7.87 5 e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC - eA/2 0.150 BSC 3.81 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.060 0.38 1.52 6 S1 0.005 - 0.13 - 7 90° 105° 90° 105° - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2, 3 N 14 14 8 Rev. 0 4/94 1 REFERENCES 1. Betka. A and Moussi. A (2010), 'A Comparative study on the perIormance improvement oI a PhotoVoltaic pumping system¨, Journal oI Electrical systems ,Vol. 6, No. 3, pp.426-435. 2. Castaner. L and Silvester. S (2002), 'Modelling oI Photovoltaic systems using P-Spice¨, France. John Wiley Sons. 3. DuIIie. J. A and Beckman. W. A. (2006), 'Solar Engineering oI Thermal processes¨, John Wiley Sons, Third Edition. 4. Gow. J. A. and Manning. C. D.(1996), 'Development oI a Model Ior a Photovoltaic Arrays suitable Ior use in simulation studies oI Solar Energy Conversion Systems¨, Power Electronics and Variable Speed Drives, ConIerence Publication, No.429, pp. 69-74. 5. Hamadi. Z, Monce. J, Nejib. H and CheriI. A (2007), 'Modelling and Simulation oI Photovoltaic Systems under Matlab Simulink¨, International Journal oI Power and Energy Sytems, Vol. 27, No. 1, pp. 68-74. 2 6. 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Veerachary. M, Senjyu. T and Uezato (2001), 'Smallsignal analysis oI 3 Interleaved Dual boost converter¨, International Journal oI circuit theory And application, Vol. 29, No. 6, pp. 575-589. 13. Walker. G(2001), 'Evaluating MPPT converter topologies using a matlab PV Model¨, Journal oI Electrical and Electronics Engineering, Australia, Vol. 21, No. 1, pp. 45-55. 14. www.mathworks.com