SEMICONDUCTOREQUIPMENThttp://www.asmpacific.com ASM Semiconductor Equipment Products Index Materials Handling Model 3 AD9212 / AD9210 IS9012TS Materials Handling Process Harrier Xtreme 4 AD8312 AD8312R Wire Bonding Equipment Eagle Xtreme Gold Ball WB Epoxy DA 5 AD838R Epoxy DA AD908 Stud Bumping Equipment AD211 / AD212 Hummingbird Gold / Copper Stud Bumping AL501 Aluminium Wire Wire Bonding AB559A Series Fine Equipment Aluminium Wire AB530 Eutectic DA 7 Materials Handling AD220 SD890A AD880 AD881 Series Strip Form Substrate Soft Solder DA 8 AD100 6” Wafer Handling 12” Wafer Handling Ultrasonic Wedge Wire Bond 15 AD830U AD830UR Die Attach Equipment 13 14 Eagle60AP-LD Heavy 6 AD830 / AD830R 8” Wafer Handling iHawk-V Thermosonic Gold Ball Wire Bond iHawk-02 AD838 AD838P iHawk Xtreme Eagle Xtreme X2L IS8912DA AD838L 12 TwinEagle Xtreme Flip Chip IS9012LA LinDA Process ASM GoCu IS9012TC 12” Wafer Handling Model Curing Oven Epoxy DA Strip / Reel Form Substrate Model SR902 / SR902L COE139 / COE139R PC139 / PC139R2R Process Reflow Oven Snap Curing Oven AD819-PD AD819-LD Eutectic DA MCM12 Multi-Chip DA COG900 / COG930 FOG900 / FOG930 Misc. IS898GA IRGA868 IS868LA2 IS600 Materials Handling AOI, Map Sorting / Die Sorting Equipment 1 4” Wafer Handling 6” Wafer Handling Model Materials Handling ACF D/A Glass Attach 10 Process ES100 Advanced Optical Inspection (AOI) MS100 Plus Map Sorting AS899 Die Sorting Molding Equipment 11 Model Strip Form Substrate IDEALmold™ 80/120/170t Reel Form Substrate IDEALmold™ R2R Strip Form Substrate OSPREY Strip Form Substrate Lens Holder Attach Solder Paste DA / Clip Attach eClip 9 12” Wafer Materials Handling Strip / Reel 16 Transfer Molding IDEALab™ 17 IDEALcompress™ WLP300 Compression Molding IDEALab™-WLP Model Dispensing/ Form Substrate DS500 Series Jetting Strip Form System DS520 / M Substrate Process Process Glob-top, Dam & Fill Jetting 18 etc. TO264. Finish QFN/MLP. TO220. TSOP. Testing System Model CSBGA / PBGA. TSSOP. SC70. etc. FT-Power Laser Mark Handler Process 21 BP2000 Ball Placement BCC. QFN. Trim/Form/ TQFP. TO3P. Equipment DPAK. TSOP. MBGA. TSOP. SOT23. FT2018 TO220. BGA. SiP & etc. Handling MBGA. SOT113.ASM Semiconductor Equipment Products Index Materials Handling DPAK. SOT113. TO220. SOT223. D²PAK. FET-CLUSTER Singulation and Finishing Integrated System M-BGA. SOT223. SOT89. QFN. Top LED & Taping System Sideview LED Process SLS230T Plus Process LED Tester SMD LED Testing and Sorting SLT400 SMD LED Taping IP360 Series High Power LED Testing & Sorting 22 Turret Based Test Handler 20 FV2030 Complete Quality Inspection Handler M-CAN. Test and SOIC. Ball Placement and CSP Handling Equipment Mechanical Press Trim / Form SOT. System Model 18 MP209 MP-TAB Discrete Package SD Card MP-SDS SD Card Singulation All kinds of Laser Mark IC and Handling Power Device Matrix Equipment Leadframes Materials Handling Model Process LS1000 Model FT2030 SC59. CSP. SOIC. SOD. DPAK. MLF. TSOP. DFN. TO3P. etc. SC59. SOT23. S-CAN. QFN. Materials Handling 19 TSSOP. FT1000 Carrier Based Test FT1000-HD Hot Test SO. flex BGA & etc. DFN & etc. SOP. CSBGA. SOD923. CS900 High Speed Tape Sorting Measuring Electrical / Optical Characteristics for Die / Package Model TLB203 SLS230 / S LED (SMD) SMD type Sorting & Chip LED. BCC. QFP. MLP. etc. Singulation TSSOP & etc. Materials Handling Materials Handling Process 2 . QFN. TO264. etc. QFN. SC70. QFN / MLP. etc. SIP9. SOP. TSSOP & etc. singulated units on carrier. BGA. singulated units on carrier. etc. ceramic panels. ceramic panels. etc.g. CLCC. singulated units on carrier. lead frames. PCB.g. BGA. etc. Excellent foreign material control for image sensor application • • • • HEPA fan filter unit providing clean air flow Blow & suck cleaning for housing substrate Workholder with clean cell feature And more…… Flexible indexing system for substrate or boat carrier design Real time epoxy pattern inspection and position alignment Up to 12” wafer handling capability Supporting both flip chip and direct die attach processes . PLCC. PCB. High productivity with individual dual flip chip bonding systems Extra wide substrate handling Precise placement with latest linear motorizing systems Up to 12” wafer handling capability Supporting flux dipping flip chip process SMEMA standard compatible Convertible flip chip and direct die bonding processes (option) AD9210 • Up to 210 mm track width handling capability • Tape feeder handling capability (option) IS9012TS Applications: Thermosonic flip chip bonding on SBGA.12” Flip Chip Bonding Equipment Dual Head Flip Chip Bonder Thermosonic Flip Chip Bonder AD9212 / AD9210 (for Image Sensor Application) Applications: Flip chip bonding on SBGA. PLCC. lead frames. CLCC. BGA. etc. BGA. singulated units on carrier. High precision thermosonic flip chip bonding process Excellent foreign material control for image sensor application • HEPA fan filter unit providing clean air flow • Blow & suck cleaning for housing wafer • And more…… Large range of die sizes handling Intelligent self-compensated bond force control Patented transducer design Consistent and independent heating controls Workholder with rigid clamping system to hold substrate during bonding Thermocompression Flip Chip Bonder 12” Flip Chip Bonder (for Image Sensor Application) (for Image Sensor Application) IS9012TC IS9012LA Applications: Thermocompression flip chip bonding on e. Excellent thermocompression (TC) bonding performance Excellent foreign material control for image sensor application • HEPA fan filter unit providing clean air flow • Blow & suck cleaning for housing wafer • And more…… Flexible indexing system for substrate or boat carrier design Real time dispensing pattern inspection and position alignment Up to 12” wafer handling capability Supporting both flip chip and direct die attach processes (option) 3 *Remark: All performance is package dependent Applications: Image sensor flip chip bonding on e. g. World’s first 12” dual dispensing die bonding series Design for all-round stacked dice and thin die bonding process • Panel bonding capability • Excellent substrate warpage control • Remarkable thin die handling capability with various patented designs (option) Individual pick and bond system High precision bonding with high resolution vision system US PATENTED 12” Automatic Die Bonder 12” Automatic Die Bonder (Reel Form Materials Handling) (for Image Sensor Application) AD8312R IS8912DA Applications: Reel form materials handling e. TSSOP. • Curing oven – PC139R2R • Buffer station • And more. TQFP.12” FLIP CHIP / DIE ATTACH BONDING EQUIPMENT 12” Die Attach Equipment US PATENTED US PATENTED 12” Automatic High Speed Die Bonder 12” Automatic Die Bonder AD8312 (for Stacked Dice Application) Applications: Mini-BGA. etc. PLCC... PDIP. CLCC. QFP.. World’s first 12” dual dispensing die bonding series Implementing patented double decoupling bond head system Universal workholder design for various packages Real time epoxy pattern inspection and position alignment In-line capability with curing oven or machine cascade LinDA Applications: Stacked dice application on Mini-BGA. flex BGA. MEMS. metal lead frames or flex substrates. SOIC. World’s first 12” dual dispensing die bonding series Implementing patented double decoupling bond head system Real time epoxy pattern inspection and position alignment Strategic module designs suitable for handling backside plated substrates In-line capability with other equipment. TQFP. PLCC. singulated units. e. etc.g. etc.g. QFN.. CSPBGA. CSPBGA. Excellent foreign material control for image sensor application • • • • HEPA fan filter unit providing clean air flow Blow & suck cleaning for housing substrate and wafer Workholder with clean cell feature And more…… Flexible indexing system for substrate or boat carrier Real time epoxy pattern inspection and position alignment Up to 12” robotic wafer handling capability 4 . flex BGA. PCB. *Remark: All performance is package dependent Applications: Image sensor die bonding on e. TSOP. PLCC. smartcard substrates. TSSOP. etc. TSOP. QFP.. BGA. MLP/QFN. TSOP. High speed performance • Implementing patented bond head design • Supporting dual dispensing system Extra large bonding area: up to 4” width substrate handling capability Automatic input reel system Graphical user interface with multi-language support In-line capability (option) with • Lead frame cutting system – LFC130 or • Curing oven – COE139R / PC139R2R US PATENTED Automatic High Speed Epoxy Die Bonder Automatic High Precision Epoxy Die Bonder AD838L AD838P Applications: Direct substrate indexing.g. QFN. TSSOP. e. SOT. etc. PLCC. TQFP. Excellent accuracy with full range of inspection algorithms Extra large bonding area: up to 3” width substrate handling capability Graphical user interface with multi-language support Providing graphical SPC data with latest IQC system . SOT. etc. metal lead frames or flex substrates. TQFP. e. High speed performance • Implementing patented bond head design • Supporting dual dispensing system Excellent accuracy with full range of inspection algorithms Extra large bonding area: up to 4” width substrate handling capability Graphical user interface with multi-language support Providing graphical SPC data with latest IQC system AD838R Applications: Reel form materials handling. e. ceramic substrates for high power LED. SOIC. etc.g. top LED.g.g. etc. Strategic direct indexing algorithm suitable for direct ceramic indexing or other materials handling Implementing excellent precision with • Various inspection systems during bonding process • Patented bond head design Extra large bonding area: up to 4” width substrate handling capability Excellent substrate warpage control Implementing latest global substrate alignment 5 US PATENTED *Remark: All performance is package dependent Applications: High precision bonding performance on. TSOP. QFN. PLCC. e.8” Die Attach Equipment US PATENTED US PATENTED Automatic High Speed Epoxy Die Bonder Automatic High Speed Epoxy Die Bonder AD838 (Reel Form Materials Handling) Applications: High density lead frames. SOIC. high power LED. SOIC.8” Die Attach Equipment 8” DIE ATTACH EQUIPMENT PATENT PENDING US PATENTED Automatic High Speed Die Bonder Automatic High Precision Epoxy Die Bonder AD830 / AD830R AD908 Applications: High density substrates. suitable for linear scanner application. e. SOT. top LED. etc. SOJ. SOD. e. chip LED. etc. for eutectic die attach process High throughput by • Implementing patented bond head design Providing excellent oxidation control with forming gas supply Providing excellent oxidation control with forming gas supply Graphical user interface with multi-language support Graphical user interface with multi-language support Supporting flux eutectic or epoxy die attach process by equipping Supporting flux eutectic or epoxy die attach process by equipping with dispensing or stamping system (option) In-line capability with gold ball wire bonding system – iHawk Xtreme series (option) In-line capability with gold ball wire bonding system *Remark: All performance is package dependent with dispensing or stamping system (option) – iHawk Xtreme series (option) 6 . e. etc. SOD.g. SOIC. metal lead frames. side view LED. High precision placement with special PR alignment Implementing patent pending bond head design Extra long dispensing area for large aspect ratio die handling Supporting epoxy writing and dotting capability Excellent substrate warpage control with moving bond workholder table design US PATENTED US PATENTED Automatic High Speed Eutectic Die Bonder Automatic High Speed Eutectic Die Bonder AD830U AD830UR Applications: High density substrates.g. High throughput by • Implementing patented bond head design Applications: Reel form materials handling.g. etc. top LED. High speed performance • Implementing patented bond head design • Supporting dual dispensing system Widely implementing linear motor systems Graphical user interface with multi-language support AD830R for reel form materials handling Up to 8” wafer handling capability (option) Applications: Large aspect ratio die handling. e. SOT. discrete units. e. ceramic/wafer submount for direct eutectic process Implementing patented technologies • Double decoupling bond head system • Heated collet die attach process Extra large bonding area: • AD211: up to 4” x 4” bonding area • AD212: up to 8” x 8” bonding area Providing excellent oxygen level control Excellent void control with proven heat tunnel design and mature process know-how Anti-thermal shock by equipping with pre-heat and post-heat stations Automatic materials handling Automatic Soft Solder Die Bonder SD890A Applications: High power devices. DPAK. Implementing flexibility with • Matrix lead frame handling with XY shuttling bond head system • AB dice handling with rotary collet bond arm design • Up to 8 independently controlled heating zones suitable for various temperature profile requirements Precision solder volume and pattern control with • Precise solder wire feeding and spanking system Providing excellent oxygen level control with forming gas supply Patented solder writing technology for excellent solder control (option) 7 *Remark: All performance is package dependent Applications: Strip form of high power LED lead frames for direct eutectic die attach process Implementing patented technologies • Double decoupling bond head system • Heated collet die attach process Providing excellent oxygen level control Excellent void control with proven heat tunnel design and mature process know-how Automatic die theta alignment with precision stage Automatic lead frame input and output handling capability . TO-220. etc.g.g.8” Die Attach Equipment US PATENTED US PATENTED Automatic Eutectic Die Bonder Automatic Eutectic Die Bonder AD211 / AD212 AD220 Applications: Panel form of high power LED packages. PowerSO. DPAK matrix. World’s fastest epoxy die bonding system with patent pending technologies – dual shuttling system Pro-longing MTBA with new inputting / outputting systems • Inputting system: dual stack loading inputting system / multi-magazine inputting elevator system • Outputting system: multi-magazine outputting elevator system Precise epoxy stamping capability with pre-bond inspection Applications: Suitable for large area epoxy die bonding process Extra large bonding area: 8” x 8” substrate handling Providing high speed die attach with DDR bond head system Implementing excellent flexibility – capability of handling various substrates with corresponding carrier design 6 mil small die handling capability Graphical user friendly interface with MS Windows® based operating system Getting advantages between quality control and bonding speed with latest post-bond inspection system Automatic Die Bonder Automatic High Precision Epoxy Die Bonder AD881 Series (for Photo Diode Application) Applications: Flexible of handling various substrates.g.6” Die Attach Equipment 8” / 6” DIE ATTACH EQUIPMENT PATENT PENDING High Speed Epoxy Die Bonder Automatic Die Bonder (for Vertical LED Application) AD880 AD100 Applications: Vertical LED. infrared diodes. High precision epoxy die bonding with • 2-in-1 stamping and bonding system • Widely implementing linear motor systems • Full range of PR inspection at various stages for precision bonding Carrier free metal cans handling design Supporting various configurations to fit different applications • Programmable tilting workchuck for PD application • Rotary workchuck for VCSEL application (option) • Wafer PRS with PR look ahead capability • Advanced die surface defect inspection at wafer stage *Remark: All performance is package dependent 8 . Wide range of substrates handling capability Excellent flexibility • AD881M: up to 3 wafers handling capability (with similar die sizes) • AD881H: automatic materials handling • AD881MH: up to 3 wafers and automatic substrate handling capability Providing extremely high speed die attach with DDR bond head system Powerful inspection system providing excellent bonding quality AD819-PD Applications: Metal can packages.g. etc. photo transistors. photo diodes on stem. etc. etc. e. metal cans. bent lead frames. e. g. wafer submount.4” glass substrate handling – COG930 In-line capability with FOG900 / FOG930 (option) Up to 13. e. High speed and precision performance • Full range of inspection system at each process • 4D (XYZ-theta) workholder system driven by precise linear and DDR actuating system 9 Applications: Various types of glass and flex. singulated unit. etc. TFT. e. TFT.4” glass substrate handling – FOG930 *Remark: All performance is package dependent system In-line capability with COG900 / COG930 (option) .6” Die Attach Equipment Other Die Attach Equipment US PATENTED Automatic High Precision Eutectic Die Bonder (for Laser Diode Application) AD819-LD Applications: Metal can packages. metal can. e. CSTN. one pass LD and submount on stem Precision placement with • Widely implementing linear motor systems • Full range of PR inspection at various stages for precision bonding Carrier free metal cans handling design Individual bonding system for submount and LD attach Providing consistent eutectic environment • Excellent oxygen level control with nitrogen gas supply • Programmable temperature profile on various stations Anti-thermal shock with pre-heating and post-heating stations Multi-chip Module Bonder MCM12 Applications: Various multi-chip packages on. STN.g. etc. High speed die attach process with patented technologies Precision placement with latest inspection system Implementing excellent flexibility by supporting • • • • • • • • Up to 12” wafer handling capability Up to 14 types of picking tools handling capability Up to 5 types of ejecting kits installation Extra large substrate handling SMD bonding capability Direct die attach / flip chip bonding capability Auxiliary dispensing system And more…… Supporting automatic wafer exchanging system Automatic COG Bonder Automatic FOG Bonder COG900 / COG930 FOG900 / FOG930 Applications: Various types of glass and LSI.g. STN. e. BGA. CSTN.g. etc. High speed and precision performance • Full range of inspection system at each process • 4D (XYZ-theta) workholder system driven by precise linear and DDR actuating system Supporting various inputting and outputting configurations • Belt inputting / outputting system • Tray handling capability (option) Supporting various inputting and outputting configurations • Belt inputting / outputting system • Tray handling capability (option) Advanced inspection system with programmable LED illumination Advanced inspection system with programmable LED illumination system Up to 13. Versatile lens holder input handling system adapts for: • JEDEC standard tray / waffle tray Excellent foreign material control for image sensor application • HEPA fan filter unit providing clean air flow • Blow & suck cleaning for housing substrate • Workholder with clean cell feature • And more….... etc. Supporting automatic lens orientation check OTHER DIE ATTACH EQUIPMENT Automatic Glass Bonder Applications: Lens holder bonding on e. BT. CLCC.. substrate and lens variation High flexibility • Suitable for more compact and threadless design of lens holder Enhancing yield by instant tracking of lens holder One pass solution for lens holder bonding and focusing processes Dual glue writing capability further enhances productivity Individual pick and bond arm system further enhance bonding speed Capable of integrating various UV snap cure systems and post bond heater (option) *Remark: All performance is package dependent 10 .g. PLCC. singulated units. CLCC.g. etc. PLCC. Up to 8” wafer handling capability Excellent cover tape sealing performance for protecting bonded units in pocket tape Automatic Lens Holder Bonder High Mega Pixel Lens Holder Bonder (for Image Sensor Application) (for Image Sensor Application) IS868LA2 IS600 Applications: Lens holder bonding on e.Other Die Attach Equipment 6” DIE ATTACH EQUIPMENT Automatic IR-Cut Filter Bonder (for Image Sensor Application) (for Image Sensor Application) IS898GA IRGA868 Applications: IR glass bonding on substrates. PLCC. BGA. or singulated lens holders.. Flexible indexing system for substrate or boat carrier Supporting glass presentation on mylar / waffle pack Dual glue writing capability further enhances productivity Capable of integrating various UV snap cure systems (option) Applications: IR glass bonding on lens holder Flexible materials handling capabilities • Tape & reel input / output lens holder handling • Vacuum / mechanical picking system to fit different lens holder Excellent foreign material control for image sensor application • HEPA fan filter unit providing clean air flow • Blow & suck cleaning for housing substrate • Workholder with clean cell feature • And more….g. etc. e. PCB. CLCC. Excellent foreign material control for image sensor application • • • • HEPA fan filter unit providing clean air flow Blow & suck cleaning for housing substrate Workholder with clean cell feature And more…. for high mega pixel application Improving focusing quality of high resolution camera Active feedback algorithm to compensate die tilt.. test and sort processes • Sorting good die only with advanced die surface defect detection at wafer stage Excellent flexibilities • Supporting various types of testers integration • Flexible bin block arrangement • Up to 56 bin blocks can be installed once (option) Precision probing performance with XYZ testing stage motions User-friendly interface with Windows® based operation system 11 *Remark: All performance is package dependent . Map Sorting / Die Sorting Equipment US PATENTED Total Clip Bonding Solution Automatic AOI System eClip ES100 Applications: High power discrete units. etc.Other Die Attach Equipment AOI. laser diode. based on wafer map information High speed sorting driven by • Dual heads sorting system • Direct drive rotary (DDR) motor and linear motor system User-friendly interface with Windows® based operation system Extra large sorting area Supporting pre-scan capability Applications: Individual LED dice testing and sorting solution High speed die testing and sorting system with rotary testing station design • Dual individual linear bond heads for pick and place processes • Parallel pick. e.g. e. PowerSO.g. white LED. blue LED. All-in-one bonding solution from die bonding. etc. LED die High speed and precision inspection performance True color inspection capability Supporting pre-scan capability Picking “No-Good (NG) die” capability (option) Supporting independent temperature controlling regions • 8 heating zones + 1 cooling zone Consistent reflow environment • Excellent oxygen level control with low level of forming gas consumption • Programmable temperature profile on various stations Map Sorter Die Sorter MS100 Plus AS899 Applications: Sorting die. DPAK matrix. e.g. clip bonding to reflowing process High throughput by • Implementing patented bond head design • Supporting dual dispensing system • Array clip bonding capability Applications: Automatic advanced optical inspection system for die. MAP SORTING / DIE SORTING EQUIPMENT A capability enabling faster and easy conversion from Gold to Cu/CuPd wire bonding With GoCu capability. Dual high speed wire bond heads system Highest output per square foot area User-friendly. intelligent Windows® based interface Innovative algorithm for high speed PR Supporting copper wire bonding & copper BSOB (option) *Remark: All performance is package dependent Applications: Ultra low–k wire bonding. ultra low loop wire bonding High performance gold wire bonder Highest output per square foot area Ultra fine pitch machine • Excellent vibration suppression technology to eliminate vibration coupling Capable to handle high pin count package • Supporting ultra low loop bonding • Dual wire size & wire types application AOI. stacked & thin die overhang wire bonding. HP LED. CuPd UPH/productivity is higher than gold wire bonding Converting to Cu/CuPd from gold wire bonding in simple clicks Breakthrough in wire threading with auto self rethreading feature Revolutionary auto PR & auto loop definition Extreme High Speed Wire Bonder OTHER DIE ATTACH EQUIPMENT Extreme High Speed Wire Bonder GOLD BALL WIRE BONDING SYSTEM Extreme High Speed Wire Bonder Ultra Fine Pitch Wire Bonder Harrier Xtreme Eagle Xtreme Applications: QFN. ultra low loop wire bonding Wider bonding area Ultra small BPP bonding capability Precision placement with nano-scale resolution 12 .Gold Ball Wire Bonding System ASM GoCu TwinEagle Xtreme Applications: Ultra low–k wire bonding. high density discrete packages. etc. stacked & thin die overhang wire bonding. SMD LED. multi-chip modules. SMD LED. high density discrete packages.Gold Ball Wire Bonding System High Speed Wire Bonder Automatic Gold Ball Wire Bonder (for Discrete/Opto Applications) (for Vertical Lead Frame Application) iHawk Xtreme iHawk-V Ultra High Speed Wire Bonder Automatic Gold Ball Wire Bonder (for Hybrid Application) (for Bent Lead Frame Application) Eagle Xtreme-X2L iHawk-02 Applications: Gold ball wire bonding. e. High speed wire bonding capability Implementing patented design concept Extremely large bonding area 13 *Remark: All performance is package dependent Applications: Gold ball wire bonding on vertical lead frames Innovative dual track design enhancing bonding speed Pro-longing MTBA with latest input / output magazine handling Innovation in optics & PR system especially for smaller LED dice Applications: Bent lead frame handling capability for piranha LED application High speed wire bonding capability Pro-longing MTBA with latest input / output magazine handling Saving cost of ownership by direct bent lead frame indexing . SiP. Innovation in optics & PR system for smaller dice Advanced PR algorithm with PR look ahead capability Faster package conversion with fully motorized material handling system Applications: One pass solution for large bond area packages. etc. HP LED. QFN. etc.g. LD assembly. etc. etc. DPAK matrix.Gold Ball Wire Bonding System Stud Bumping System Automatic Gold Wire Bonder Wafer Level Stud Bumping System (for Laser Diode Application) Hummingbird Eagle60AP-LD Applications: Metal can packages with three dimensional bonding. reliable and flexible heavy aluminium wire bonding 14 . chip-on-glass. chip-on-flex. e. LED display. Fine pitch capability for advanced packages Large effective bonding area Vision Lead Locator (VLL) to adapt lead width variation Dual colour (red-blue) LED lighting for different substrates surface reflection Gold wire wedge bonding application (option) 60° wire feeding angle capability (option) HEAVY AL WIRE BONDING SYSTEM Applications: Heavy aluminium wire bonding on power discrete packages. including TO-220.g. Rotary workholder system for multi-plane bonding • 0° to 90° programmable rotation One pass LD and submount bonding Specially designed for photonics and optoelectronic application Custom-made top plate and carrier for large range of laser diode products Applications: Gold / copper stud bumping on wafer High speed bumping performance Excellent bumping control • Fine pitch bumping capability • Stack bumping capability Implementing flexibility • Large bumping area: up to 12” wafer handling capability • Supporting gold / copper stud bumping • Automatic wafer loading system (option) • Equipping with pre-heat / post-heat system (option) GOLD BALL WIRE BONDING SYSTEM Aluminium Wire Wedge Bonding System Heavy Aluminium Wire Bonder Rotary Bondhead Wedge Bonder AL501 AB559A Series STUD BUMPING SYSTEM Heavy Aluminium Wire Bonding System Saving cost of ownership by widely implementing linear motor and DDR systems Intelligent “Smart BQM” system supervising bonding quality *Remark: All performance is package dependent AL WIRE WEDGE BONDING SYSTEM • Dual light & compact bond head systems • Hybrid wire bonding capability • Excellent motion control Applications: Chip-on-board. ceramic. multi-die. etc. High speed. multi-die / multi-PCB. e. etc. SOT.g. etc. AD8312R. e.g. etc. etc.g. flux reflow. SOT.g. AD838R or other die attach system (option) 15 *Remark: All performance is package dependent . lead free solder. e. Stable and repeatable temperature control Sophisticated oxidation level control 5 independent temperature controlling zones • Built-in dynamic temperature profiling software Selectable for various substrates handling • COE139: strip form substrate handling • COE139R: reel form substrate handling Selectable for various substrates handling • PC139: strip form substrate handling • PC139R2R: reel form substrate handling In-line capability. Excellent oxygen level control with • N2 curtains at oven’s input and output sides Consistent curing temperature control with 6 temperature control zones Applications: Curing process for die attached substrates in either strip or reel form. Up to 8 independent temperature controlling regions • 6 heating zones with 2 cooling zones Combination of convection and radiation heating modes Built-in reflow temperature profiler Sophisticated oxidation level control Automatic nitrogen cut-off function during idle state SR902L’s in-line capability with AD9212 / AD9210 or other die attach system (option) Snap Curing Oven Snap Curing Oven COE139 / COE139R PC139 / PC139R2R Applications: Curing process for die attached substrates in either strip or reel form.Aluminium Wire Wedge Bonding System Curing System PATENTED Automatic Ultrasonic Wedge Bonder Reflow Oven AB530 SR902 / SR902L Applications: Chip-on-board. High speed bonding Fine pitch capability for advanced packages Cost saving by widely implementing linear and DDR motor systems Multi-unit / multi-PCB bonding capabilities Applications: Reflowing process for high lead (>85% Pb) solder. high lead count. smartcards. AD830 or other die attach system (option) In-line capability. top LED. e. PDIP. discrete devices. Suitable for standalone or inline configuration Simple and flexible operation • Flexible press configuration of 1 to 4 presses Input and output pattern recognition features Vacuum and wedge molding capability High pre-heat temperature capability Windows® operating system Pinnacle Gating System (PGS™) molding capability (option) OSPREY • Ultra high density molding • POP capability Minimum tooling cost and shortest lead time IDEALab™ Applications: Mini-BGA. etc. SOT. SOT. QFN. QFN. CSPBGA. flex BGA.Transfer Molding System IDEALmold™ 80/120/170 ton Applications: Mini-BGA. QFP. singulated units. SOIC. SOT. TQFP. clear compound • Punch type micro QFN CURING SYSTEM Ideal for • Small lot. power devices. TSSOP. COB. flex devices. TSOP. World's only dual reel automatic molding system Pinnacle Gating System (PGS™) molding capability Suitable for standalone or inline configuration Simple operation Excellent productivity and short cycle time Fast conversion time Windows® operating system Input and output vision inspection (option) Clean cell and line scan (option) Inspection and reject punch station (option) AL WIRE WEDGE BONDING SYSTEM Applications: BGA. PDIP. SOIC. suitable for R&D Advanced packaging capability • Pinnacle Gating System (PGS™) • Tapeless QFN. high product mix production • Flexible manufacturing work cell Applications: Reel form lead frames or substrates. PDIP. singulated units. PLCC. etc. CSPBGA. etc. POP. SIM. PLCC. SOIC. POP. TQFP. World’s smallest footprint automatic molding machine Built-in PGS™ molding capability IDEALmold™ R2R TRANSFER MOLDING SYSTEM *Remark: All performance is package dependent 16 . TSOP. carrier molding.g. smartcards. Manual molding system derived from IDEALmold™ Mold chase compatible with IDEALmold™ Process parameter portability to IDEALmold™ Low conversion cost. POP. TSSOP. etc. e. QFP. power devices. flex BGA. MLP/QFN. QFP. wafer level LED.Compression Molding System IDEALcompress™ Applications: Large substrate molding: W150mm x L300mm. Cu bump pillar WLP. redistributed chip package Tape assisted on top mold to release Dispensing options • Liquid epoxy • Clear silicone • Granular powder Quick change mold chase concept with aid of IDEALtrolley™ 17 *Remark: All performance is package dependent Precision Dispensing System DS500 Series Applications: Die coat. dam and fill dispensing mechanism Custom programmable dispensing patterns & parameters Automatic substrate handling capability with input / output elevator systems (option) Dual dispensing heads with adjustable pitch (option) Reel-to-reel handling capability (option) . Cu bump pillar WLP. fine pitch. gel coating. exposed solder ball WLP. including. sealing. long wires • Multi stacked die package • Low-k die • And more. embedded wafer ball grid array..WLP Applications: WLP. low volume manufacturing • Small lot assembly • Compact Ideal for eco-friendly manufacturing • No material wastage • No mold cleaning required Ideal for complex designs • Thin chip. adhesive dispensing. LED Ideal for high-mix. exposed solder ball WLP. granular powder dispensing Dispensing / Jetting System DS500 DS500-IL IDEALab™ .… WLP300 Applications: WLP. Excellent encapsulant placement repeatability and dispensing quality Extra large dispensing area with gantry table design Glob top. embedded wafer ball grid array. clear silicone. etc. underfill dispensing. redistributed chip package World’s first 12” automated WLP compression encapsulation system Flexible to handle wafer sizes ranging from 4” to 12” Equipped with encapsulant weight compensation Dispensing options • Liquid epoxy • Clear silicone • Granular powder Various dispensing configurations.. liquid epoxy. wafer level LED. etc. Extremely high speed jetting with in-house developed jetting system Excellent performance Applications: Individual type SD card substrates Self contained system to accept stacked magazine loading and un-loading Linear servo carrier transportation provides a flexible solution to variety of frames Supporting mark inspection Flexible to integrate with any third party vision inspection 18 . D²PAK. TSSOP & etc. TSOP. SOD. DFN. QFN. SOP.Trim / Form / Singulation System Precision Jetting System Mechanical Press Trim / Form System DS520 / M MP209 COMPRESSION SYSTEM Dispensing / Jetting System Maintaining fluid homogeneity by strategic agitating system Supporting individual dual workholders control Automatic materials handling with DS520M • • • • QFP system (JEDEC tray off-loading) SOIC system (Plastic tube off-loading) SOT system (Bulk off-loading) In-line system (integration with laser mark and finishing modules) Discrete Package Trim / Form System Memory Card Singulation System MP-TAB MP-SDS Applications: SOT. TQFP. High UPH discrete package singulation Suitable for ultra high density lead frames Modular construction for flexible integration Vision inspection for orientation & uncut dam bar *Remark: All performance is package dependent TRIM / FORM / SINGULATION SYSTEM • High accuracy & repeatability • Easy to operate & maintain • Long modules life Applications: DPAK. High speed eccentric cam-follower driver mechanism with synchronized indexer Automatic tool height inching mechanism for tooling quality assurance High speed running trim / form operation Modular construction configurable to accommodate different applications DISPENSING / JETTING SYSTEM Applications: Jetting encapsulant onto various substrates. QFN. DFN & etc. TO220. including phosphors mixed silicone on LED packages. 5D lead inspection with lead co-planarity and stand-off check • In-pocket inspection . etc. etc. TO3P. SIP9L. etc. SOT23. MBGA. High speed performance with strategic testing sequence Intelligent buffer track design between HVT and main modules Supporting rotary table for isolation test Up to 4 test stations testing 8 units for HVT Up to 8 test stations for non HVT test on rotary table Advanced vision technologies • Mark inspection in table • 2. QFN/MLP. 5S inspection. TO252. Tailor-made for mini-discrete packages with high speed and high accuracy performance 18 high speed turret pick heads for efficient processing of multiple process steps with extremely short indexing time Individual up down driving mechanism further allowing high speed performance Flexible system configurations Advanced vision technologies • 2. TO264. in-pocket inspection. mark and surface inspection Turret Based Test Handler Turret Based Test Handler FT2018 FT-Power Applications: SC59. TO247. 30 high speed turret pick heads for efficient processing of multiple process steps with extremely short indexing time High flexibility • Configuring any mix of process steps to provide a full range of flexible solutions Flexible system configurations • Onload: stack tube / vibratory bowl feeder / metal tray • Offload: stack tube / plastic tube / tape-and-reel / multiple tubes / multiple bins Advanced vision technologies • 2.5D lead inspection with lead co-planarity and stand-off check.Laser Mark Handler Test and Finish Handling Equipment Laser Mark Handler Turret Based Test Handler LS1000 FT2030 Applications: All kinds of IC lead frames and power device matrix lead frames Standard module and fully constructed in modular. TO263. SOD923. SC70. mark and surface inspection 19 *Remark: All performance is package dependent Applications: TO220 series. flexible for any process customization Open platform to accept any laser marker in market Walking beam type transportation provides a flexible solution to variety of packages Optional mark inspection Flexible to integrate with any third party vision inspection Applications: TSSOP. in-pocket inspection. SOT113.5D lead inspection with lead co-planarity and stand-off check. 5S inspection. SOT223. Hi-density carrier based test handler system capable of testing 256 devices in parallel Temperature range: ambient to 135°C (option: 155°C) Adjustable contact force of 120 kgf (option: 240 kgf) Heat compensation during test Flexible input / output configuration Combining with finishing module to provide a one-stop testing. lead length. lead co-planarity. etc. SOT89.Test and Finish Handling Equipment Complete Quality Inspection Handler Singulation and Finishing Integrated System FV2030 FET-CLUSTER Applications: SC59. In-pocket inspection: final package & lead quality check before packing 30 high speed turret pick heads for efficient processing of multiple process steps with extremely short indexing time TEST AND FINISH HANDLING EQUIPMENT Flexible system configuration • Onload: stack tube / vibratory bowl feeder / metal tray • Offload: stack tube / plastic tube / tape-and-reel / multiple tubes / multiple bins Carrier Based Test Handler Memory Test Handler FT1000 FT1000-HD Applications: M-BGA. DPAK. SOT223. QFN/MLP. SOIC. MLF. SC70. 2. sorting. SOT113. stand-off & etc. TO220.5D inspection: lead standoff. Complete visual cosmetic inspection capability 6S inspection: chipping. TSSOP & etc. SIP9. TO3P. SOIC. S-CAN. TSOP. inspecting and packing solution *Remark: All performance is package dependent 20 . MBGA. QFN. molding size & etc. BCC. All-in-one solution for singulation. SOT23. QFP. piping hole. BGA. SOP. etc. lead pitch & etc. lead and in-pocket Surface inspection for molding quality check (option) Applications: SO. 2D inspection: lead width. CSP. etc. visual inspection and packing 30 high speed turret pick heads Soft cut singulation Multiple output bins Vision inspection for mark. TO264. QFN. Parallel device testing in singulated / strip form Extra large carrier loading area Programmable 3-axis carrier indexer High speed performance In-house design test contactor • Spring loaded Pogo™ pins • Unlimited multi-site testing depends on tester's resources LASER MARK HANDLER • • • • Applications: M-CAN. TSOP. TSOP. TSSOP. AS899. e. flex BGA & etc. etc. lead / ball inspection and 5 sides inspection Flexible offloading configuration – tube-tray / tray-tray / canister-tray .g. QFN.Ball Placement and CSP Handling Equipment US PATENTED Ball Placement System High Speed Tape Sorting System BP2000 CS900 Applications: CSBGA/PBGA. for die / package level sorting Large range of power supply Precision measurement Flexible implementation • Supporting up to two testing stations simultaneously • Multiple drivers and photo-detectors handling capability 21 *Remark: All performance is package dependent Applications: BCC. IP360 series. SLS230 series. MLP. CSBGA. Ultra small ball / fine pitch CSBGA capability High speed performance Flexible material handling capability • Strip form substrate / flat carrier / plastic tray / U-boat / pallet / slot magazine Patented vision alignment pick & place mechanism Patented “BSU” ball handling Patented “Smart Vibrator” ball transfer Built-in diverter for easy link-up with reflow oven LED (SMD) Testing System LED Tester System TLB203 Applications: Measuring electrical and optical characteristics on wafer prober or handler. High speed linear motor mechanism Advanced vision inspection capability • Mark inspection. SiP & etc. • SLS230S: sideview LED devices. 0805. molded LED with lens One-stop solution for test. defected chip. 215. 3528. label printing and output file generation package for good tractability of devices 22 . • Top LED devices: 3014. 020.g. BALL PLACEMENT AND CSP HANDLING EQUIPMENT SLT400 IP360 Series Applications: Chip LED. Anti-bin mixing design by detecting bin removal for automatic label printing with bin criteria Long lasting performance with latest XY table design Increasing bin capacity for large lot size Optional with vision inspection for multi-chip LED to screen out package with missing chip. unit map. 0603. before sorting Wide range of applications Applications: Top LED. 0603. sideview LED. 0805.LED (SMD) Sorting & Taping System PATENT PENDING Automatic LED (SMD) Sorting System Automatic LED (SMD) Sorting System SLS230 / S SLS230T Plus Applications: Chip LED. etc. Excellent performance by implementing patent pending design Anti-bin mixing design by detecting bin removal for automatic label printing with bin criteria Optional with vision inspection for multi-chip LED to screen out package with missing chip. 0605.g. 335. sort and output with good traceability In-house developed direct drive rotary motor and linear up down motor to maximize system throughput Flexible materials handling input material handling LED (SMD) SORTING & TAPING SYSTEM Ingenious (LED) Packing System LED (SMD) TESTING SYSTEM Automatic LED (SMD) Taping System • Input system: wafer frame / bowl feeding system • Output system: tape-and-reel output. etc. 5050. sideview LED.g. 3014. 010. 020. 3020. e. etc. top LED. e. Optional wafer barcode scanning. In-house developed direct drive rotary motor and linear up down motor to maximize system throughput Advanced inspection algorithm for high accuracy inspection Ensuring taping for good units with supporting test contact technology Simple and easy operation with MS Windows® operating system Wide range of applications • Chip LED devices: 0402. 3528. etc. e. 008. etc. etc. defected chip. etc. etc. 5050. before sorting • SLS230: chip LED devices. 010. 0402. 3020. • Sideview LED devices: 008. etc. etc. silicon. *Remark: All performance is package dependent Applications: Ceramic. etc. bin frames and / or bins Powerful inspection capability • Wafer inspection • Tape-and-reel in-pocket inspection. 1206. 24) DDR Memory / Memory Card Solution Eagle Xtreme MP-SDS (P.Manufacturing Solution Discrete Solution AD838 (P. 12) (P. 12) PC139R2R (P. 4) Harrier Xtreme AD838R (P. 16) Molding MEMS Solution (P. 13) Curing Die Bonding iHawk Xtreme Wire Bonding AD8312 AD838 (P. 14) (P. 16) Wire Bonding (P. 18) (P. 17) . 7) (P. 13) (P. 15) (P. 16) Molding BEP System Smartcard / RFID Solution AD8312R (P. 18) BP2000 (P. 5) Die Bonding 23 iHawk Xtreme DS500 Series Wire Bonding Dispensing (P. 4) IDEALmold™ R2R (P. 11) (P. 21) (P. 12) Die Bonding Wire Bonding IDEALmold™ (P. 5) SD890A (P. 12) LinDA TwinEagle Xtreme (P. 5) AD838R AL501 ASM GoCu eClip Harrier Xteme iHawk Xteme (P. 18) (P. 12) Die Bonding MP209 (P. 4) (P. 13) IDEALmold™ MP-TAB FT2018 Molding Trimming & Forming Testing & Finishing (P. 5) (P. 17) Molding Dispensing / Jetting (P. 8) (P. 6) (P. 18) COB Solution AD880 (P. 12) AD830U AD220 (P. 12) AD830 iHawk Xtreme (P. 7) DS500 (P. 17) Dispensing 24 . 22) Sorting SLT400 (P. 14) AB530 (P. 18) (P. 7) Die Bonding IDEALab™ . 8) Die Bonding (P. 22) Packing SMD LED Solution Harrier Xtreme SLS230/S (P. 17) Harrier Xtreme (P. 13) Die Bonding Wire Bonding DS520/M (P. 22) Taping Vertical LED Solution AD100 iHawk-V DS520/M Die Bonding Wire Bonding Jetting (P. 15) Wire Bonding DS500 Series (P. 13) Wire Bonding (P. 13) (P. 22) SLS230T Plus (P.WLP IP360 Series (P. 18) Jetting (P.Manufacturing Solution HP LED Solution IDEALcompress™ AD211/ AD212 (P. 8) AB559A AD881 (P. 6) (P. 17) DS520/M iHawk Xtreme (P. BEP In-line Solution LS1000 + MP209 Applications: DPAK. TSOP. QFN. TO. TSSOP. SOT. TQFP. SO. D²PAK. TO220. etc. Slot Magazine Onload LS1000 Laser Mark Handler System MP209 Trim/Form System Slot Magazine Offload LS1000 + MP209 + FT2030 Applications: DirectFET™ LS1000 MP209 Laser Mark Handler System 25 Trim/Form System FT2030 Turret Based Test Handler Singulation Press Incline Offload . Japan 〒190-0022 東京都立川市錦町 1-7-18 立川エフビル 5 階 Tel : 81-42-521 7751 Fax : 81-42-521 7750 ZEMOS Korea Inc. Tel : 1-408-451 0800 Fax : 1-408-451 0808 M81 . Korea 광주광역시 북구 대촌동 958-14 하이테크센터 501 호 500-470 Tel : 82-62-973 4174 Fax : 82-62-973 4216 ASM Pacific (Holding) Limited Taiwan Branch 10F. 3F. Taiwan 香港商先進太平洋股份有限公司 台灣分公司 台北辦事處 新北市 中和區 中山路二段 530 號 10 樓 Tel : 886-2-2227 3388 Fax : 886-2-2227 3399 ASM Pacific (Holding) Limited Taiwan Branch 1F. Ladyao. Sec 2 Chung Shan Road. Vibhavadi Tower. Tachikawa F-Bldg. 美國 ASM Pacific Assembly Products Inc. No. 628-6.Z. California 95112-4209 U. No. Hong Kong 先進太平洋(香港)有限公司 香港 葵涌 工業街 16-22 號 屈臣氏中心 4 樓 Tel : 852-2619 2000 Fax : 852-2619 2118/9 ASM Assembly Technology Co Ltd 5F. Sec. China 先域微電子技術服務(上海)有限公司 南昌分公司 江西省 南昌市 解放西路 江信國際嘉園銀座大廈 1402-1404 Tel : 86-791-8820 1517 Fax : 86-791-8820 7178 Hong Kong 香港 Japan 日本 Korea 韓國 ASM Pacific (Hong Kong) Ltd 4/F Watson Centre. 31/F. 135. Phoenix Arizona 85034-7200 U. 15-1-23. Malaysia Tel : 606-951 5713 Fax : 606-951 5786 Taiwan 台灣 ASM Pacific (Holding) Limited Taiwan Branch No. He Xi District Tianjin 300211. Chung Shan Road Chung Ho Dist. China 先域微電子技術服務(上海)有限公司 深圳分公司 深圳市 南山區 僑香路 中航沙河工業區(北區) 2 號樓 4 層東 Tel : 86-755-8830 8533 Fax : 86-755-8344 6245 ASM Microelectronics Technical Services (Shanghai) Co Ltd Room 1402-4 Jiangxin Guoji Jiayuan Yinzuo No. / ASM Pacific Kor Ltd.P. Bi Li Da Building No. Johor. Bangkok 10900 Thailand Tel : 66-2-941 3181/2 Fax : 66-2-941 3183 Weltevreden 4 A. China 先域微電子技術服務(上海)有限公司 成都辦事處 成都 西芯大道四號 西部園區基地 孵化樓 C345-4 號 Tel : 86-28-8784 6551 Fax : 86-28-8784 6562 ASM Microelectronics Technical Services (Shanghai) Co Ltd Room B. 5F. China 先域微電子技術服務(上海)有限公司 蘇州分公司 蘇州市 蘇州工業園 星漢街 五號A幢 05-03/06 室 Tel : 86-512-6762 6278 Fax : 86-512-6762 6378 ASM Microelectronics Technical Services (Shanghai) Co Ltd Room 7-11. 2 Yishun Avenue 7 Singapore 768924 Tel : 65-6752 6311 Fax : 65-6758 2287 51/3. Suite 100 San Jose. Block A No. China 先域微電子技術服務(上海)有限公司 天津分公司 天津市 河西區 友誼路 41 號 大安大厦 B 座 705 室 Tel : 86-22-5881 3008 Fax : 86-22-5881 3009 ASM Microelectronics Technical Services (Shanghai) Co Ltd Room C345-4. No. 2.S.S. Taiwan 香港商先進太平洋股份有限公司 台灣分公司 台中辦事處 台中市 潭子區 中山路 2 段 135 號 8F-1 Tel : 886-4-2535 6390 Fax : 886-4-2535 6820 ASM Assembly Equipment Malaysia Sdn Bhd 24A.V. Zu Chong Zhi Road Lot 1505 Shanghai Zhangjiang Hi-Tech Park Shanghai 201203. Nanshan District Shenzhen 518053. Deung Chon Dong Kangseo Gu.A. New Taipei City. Da An Building B No. 5 Xing Han Street Suzhou Industrial Park Suzhou 215021. Jalan Medan Ipoh 1B Medan Ipoh Bistarli 31400 Ipoh Perak. 85 Jiefangxi Road. China 先域微電子技術服務(上海)有限公司 東莞分公司 東莞市 樟木頭鎮 東深公路旁荔苑大道 泰安廣場 A 棟四樓 A7-A11 Tel : 86-769-8712 5600 Fax : 86-769-8712 5601 ASM Microelectronics Technical Services (Shanghai) Co Ltd East Wing. 18/2 Floor Ngamwongwan Road. 530.E. Seoul 157-030. 22 Lv Ling Road Xiamen 361009. China 先域微電子技術服務(上海)有限公司 上海市 張江高科技園區 祖冲之路 1505 弄 55 號 2 樓 Tel : 86-21-5080 5465 Fax : 86-21-5080 5467 ASM Microelectronics Technical Services (Shanghai) Co Ltd Room 705. 15-1-24 Medan Kampung Relau 11900 Penang. Lane 91. Tingkat Satu. Prime Street Corner Enterprise Street Madrigal Business Park. Malaysia Tel : 603-7806 4942 Fax : 603-7806 4943 ASM Assembly Equipment Malaysia Sdn Bhd 1.A. 7.A. Chathuchak. Dataran Glomac Pusat Bandar Kelana Jaya 47301 Petaling Jaya. 41 You Yi Road. No. Taiwan 香港商先進太平洋股份有限公司 台灣分公司 新竹辦事處 新竹市 東美路 91 巷 7 號 1 樓 Tel : 886-3-573 3750 Fax : 886-3-573 3551 ASM Pacific (Holding) Limited Taiwan Branch 8F-1. 4-2. Kaohsiung. Block A. Block 2 CATIC (Zhonghang) Shahe Industrial Zone Qiao Xiang Road. 16-22 Kung Yip Street Kwai Chung. 4th Floor. 3440 East University Drive. Tachikawa-Shi Tokyo 190-0022. 4/F. Buk-gu Gwangju 500-470. Philippines 1770 Tel : 63-2-850 4543 Fax : 63-2-850 4547 ASM Technology Singapore Pte Ltd ASM Assembly Equipment Bangkok Ltd ASM Assembly Products B.China 中國 ASM Microelectronics Technical Services (Shanghai) Co Ltd 2/F. Qingyunpu District Nanchang 330002. Muar. 3731 Al De Bilt The Netherlands Tel : 31-30-890 6310 Fax : 31-30-890 6320 U. Malaysia Tel : 604-644 9490 Fax : 604-645 1294 Philippines 菲律賓 Singapore 新加坡 Thailand 泰國 Europe 歐洲 Edgeward Development Limited Philippines Branch 2108. Malaysia Tel : 605-542 3991 Fax : 605-542 3992 ASM Assembly Equipment Malaysia Sdn Bhd B-1-12. Taiwan 香港商先進太平洋股份有限公司 台灣分公司 高雄市 811 楠梓加工出口區 東三街 4-2 號 Tel : 886-7-367 6300 Fax : 886-7-367 6399 Malaysia 馬來西亞 ASM Assembly Equipment Malaysia Sdn Bhd Bayan Point. Dongmei Road Hsinchu. (Western Regional Office) 97 East Brokaw Road. East 3 Road Street N.S. Jalan SS6/20. China 先域微電子技術服務(上海)有限公司 廈門分公司 廈門市 呂岭路 22 號 必利達大廈 31B 室 Tel : 86-592-550 9125 Fax : 86-592-550 9121 ASM Microelectronics Technical Services (Shanghai) Co Ltd Room 05-03/06. 1-7-18 Nishiki-Cho. Chengdu Hi-Tech Zone Innovation Service Centre Chengdu 611731. Tantzu Taichung. Alabang Muntinlupa City. Hi-Tech Center 958-14 Daechon-dong. Jalan Warisan 1 Taman Warisan Jalan Junid 84000. Dongshen Road Zhang Mu Tou Town Dongguan 523620. Block A Tai'an Square. Tel : 1-602-437 4760 Fax : 1-602-437 4630 ASM Pacific Assembly Products Inc. Korea 서울시 강서구 등촌동 628-6 3층 157-030 Tel : 82-2-538 5900 Fax : 82-2-561 5905 ASM Pacific Kor Ltd Room 501. com .asmpacific.SEMICONDUCTOREQUIPMENT http://www.